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Combination of Materials, Fabrication and Test Expertise Deliver LCP Laminates with Exceptional Performance and Proven Reliability

November 4, 2010 9:46 am | Product Releases | Comments

Endicott Interconnect Technologies, Inc. (EI) announced recently that the company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits....

LISTED UNDER: Substrates | Services, Calibration / Test
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Spheric Technologies Produces Lithium Battery Materials Cheaper and Faster with Microwave Furnace Systems

August 30, 2010 10:06 am | Product Releases | Comments

PHOENIX, /PRNewswire/ -- Lithium batteries are playing a central role in the new energy economy, powering everything from cell phones to electric cars. New research shows that pricey lithium battery materials can be produced cheaper and faster using industrial microwave furnace systems. Spheric Technologies, a Phoenix, Arizona, high temperature microwave technology innovator, has developed a time- and cost-saving production process for a...

LISTED UNDER: Substrates | Power, Batteries | Power, Battery

Technologically Advanced RF, Microwave, and mmW Surface-Mount Capacitor

August 20, 2010 7:58 am | Wireless Design & Development | Product Releases | Comments

Available from Richardson Electronics, the 550L Series UBCTM (Ultra-Broadband) Capacitor from American Technical Ceramics (ATC) provides reliable and repeatable Ultra-Broadband performance from 16 kHz to over 40 GHz. Desired features include: •Defense/Aerospace Extended Operating Temp. Range (-55ºC to +125ºC) •One-piece, Orientation-Insensitive Package (Rugged Ceramic Construction) •Ultra-low Insertion Loss ( •Flat Frequency Resp...

LISTED UNDER: Ceramics

Capacitors Allow Designers to Reduce their Component Count and Shrink Board Space

August 6, 2010 9:26 am | Wireless Design & Development | Product Releases | Comments

AVX Corporation has expanded on its widely popular switch mode power supply (SMPS) capacitors series, TurboCap™. These capacitors allow designers to reduce their component count, shrink board space and maintain the benefits of ceramics such as low ESR/ESL, ability to withstand transients and the ability to handle large amounts of power in an efficient and compact package....

LISTED UNDER: Ceramics

Packages Tout Complete Characterization and Microcharacterization of Carbon Nanomaterials

July 28, 2010 11:11 am | Product Releases | Comments

Thermo Fisher Scientific Inc announced the availability of two new DXR Nanocarbon Analysis Packages for the characterization and microcharacterization of carbon nanomaterials. Both packages offer large-scale chemical and materials producers complete systems for carbon nanotube analysis. Incorporating the Thermo Scientific DXR Raman platform, the packages provide information on the molecular structure and morphology of carbon nanomaterials....

LISTED UNDER: Substrates

DOE Awards Second Contract for Inspection of Infrared Materials and Products

July 22, 2009 9:32 am | Product Releases | Comments

SARASOTA, Fla. and BOLINGBROOK, Ill., /PRNewswire-FirstCall/ -- Sunovia Energy Technologies, Inc. and its partner EPIR Technologies, Inc. announced today the United States Department of Energy has awarded a second contract to EPIR Technologies to provide improved infrared (IR) detectors to be used in a new generation of tools for the inspection and characterization of infrared materials and products....

LISTED UNDER: Substrates

Integrated Receiver Modules Use Low-cost Materials and Automated Processes

May 26, 2009 6:59 am | Product Releases | Comments

MMIC Solutions Ltd. announces the first shipment of its MSx600 range of integrated receiver modules. MMIC Solutions designs and manufactures small, low cost millimeter wave radio products for high capacity communications, security and defense applications. The company's advanced technology allows these products to be manufactured using low-cost circuit board materials and automated processes.

LISTED UNDER: Boards & Modules | Substrates

Thermally Conductive Adhesives Dissipate Heat

March 6, 2009 6:56 am | Wireless Design & Development | Product Releases | Comments

Duralco 132 thermally conductive adhesives from Cotronics Corporation combine high temperature resins with highly conductive fillers to form thermally conductive, adhesive bonds with continuous service up to 500°F. They are suitable for any industrial, electrical or electronic high-power applications, including bonding and assembling heating coils, cooling coils, heating elements, heat sinks, reaction vessels, semi-conductors, rectifie...

LISTED UNDER: Ceramics

Packaging Performs in X through K Band Frequencies

September 23, 2008 11:55 am | Wireless Design & Development | Product Releases | Comments

AdTech Ceramics' Alumina High Temperature Cofired Ceramic (HTCC) and Aluminium Nitride (AIN) microwave packaging is appropriate for applications in the X through K band frequency range. The components are designed using 3D Finite Element Method (FEM) simulators and proprietary numerical simulators....

LISTED UNDER: Ceramics

Epoxy Adhesive Cures Rapidly at Room Temperature

September 22, 2008 12:45 pm | Wireless Design & Development | Product Releases | Comments

Master Bond, Inc. introduces its EP41SMED high performance, low viscosity epoxy adhesive for fast room temperature curing and bonding applications. This compound has a 5:1 mix ratio by weight, and it has “handling” time from 10 to 15 minutes at ambient temperatures. Bonds are resistant to water, oil and many organic solvents, as well as cold sterilants, ETO and gamma radiation....

LISTED UNDER: Ceramics

Sealing Electrical Connectors: When is it Worth Moving Up to Ceramic?

November 21, 2007 5:42 am | Wireless Design & Development | Product Releases | Comments

Ceramic-to-metal seals have a number of properties that allow for a more robust, durable hermetic seal and better electrical insulation than glass-to-metal seals. Morgan Advanced Ceramics (MAC) Range of Options When engineers design a seal for feedthroughs and other electrical connectors, four general classes of material are evaluated....

LISTED UNDER: Interconnect, Connectors | Ceramics

Advanced Circuit Materials

November 15, 2007 7:48 am | Product Releases | Comments

Rogers Corporation showcased several advanced circuit materials at the 2007 EuMW Week Show. These products are used in a wide range of high frequency applications, including the advanced packaging, antenna and power amplifier markets. Products displayed included new Enhanced Copper Bond Technology: This low profile copper technology provides tighter trace width tolerances, lower insertion loss and improved passive intermodulation at high op...

LISTED UNDER: Substrates

Alumina Ceramic Components

November 8, 2007 7:41 am | Wireless Design & Development | Product Releases | Comments

Morgan Advanced Ceramics (MAC) offers miniature, dry-pressed alumina ceramic components from its GBC Materials Division. Manufactured in outer dimensions ranging from 0.020” to 2”, the ceramic materials provide a cost-effective solution for demanding applications. Designed for miniature electronic devices, these small pressed alumina components are suitable for use in telecommunications, appliance and electronic applications....

LISTED UNDER: Ceramics

Compact Multilayer Capacitors for RF Applications

September 26, 2007 8:17 am | Wireless Design & Development | Product Releases | Comments

Morgan Electro Ceramics (MEC) launches its 10 mm square, type 106 RF multi-layer ceramic capacitor that offers high capacitance and performance in a small unit volume, providing operation for a variety of high RF voltage and high RF current applications. These capacitors are made from a low loss modified magnesium titanate ceramic and internal electrodes which, when sintered under controlled conditions, form a monolithic and hermetically se...

LISTED UNDER: Ceramics

Selecting Miniature Passive Components for WiMAX and WLAN Applications

August 8, 2007 7:50 am | Wireless Design & Development | Product Releases | Comments

When exploring passive component options, asking the right questions upfront can ensure the correct component is selected for your design. By Michael Dakhiya, Chris Reynolds, Kevin Christian, Avital Yaish, AVX Corporation 1. Basic design steps for selecting the correct standard passive component In a wireless world, consumers have come to expect smaller, faster, and more sophisticated electronic/electrical products from equipment ma...

LISTED UNDER: Passives, Capacitors | Ceramics

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