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Poly-Form Flexible Pre-shaped Adhesives for Bonding Diverse Materials

September 2, 2011 8:44 am | Product Releases | Comments

Multi-Seals has introduced an innovative alternative to liquid adhesives for component assembly. Multi-Seals F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. F05 has negligible vertical flow, which keeps the adhesive contained in precisely defined areas.

LISTED UNDER: Substrates

Antenna-Grade Materials Solutions will Showcase at Antenna Systems 2011

August 31, 2011 7:26 am | by Edited Janine E. Mooney, Associate Editor | Product Releases | Comments

Rogers Corporation will be showcasing its high performance, cost-effective laminate materials for antenna applications at the upcoming Antenna Systems 2011 Conference and Expo September 20-21, at the Gaylord Opryland Hotel, Nashville, TN. Antenna Systems 2011 is a leading international conference and exhibition devoted to antenna designers, manufacturers, and system integrators focusing on the latest advances in antenna systems and technology.

LISTED UNDER: Substrates

Enabling Technology for Tomorrow’s Ultrasound Imaging

July 12, 2011 7:15 am | Wireless Design & Development | Product Releases | Comments

By Chester Kaufman, STMicroelectronics Development Engineer - Medical In recent years, the landscape of ultrasound imaging technology has changed dramatically due to advancements in semiconductor and transducer technology. For instance, hand-carried ultrasound products have gone from niche products to main stream, and are today the fastest growing segment in ultrasound....

LISTED UNDER: Ceramics | Crystals
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Enabling Technology for Tomorrow’s Ultrasound Imaging

July 12, 2011 7:15 am | Wireless Design & Development | Product Releases | Comments

By Chester Kaufman, STMicroelectronics Development Engineer - Medical In recent years, the landscape of ultrasound imaging technology has changed dramatically due to advancements in semiconductor and transducer technology. For instance, hand-carried ultrasound products have gone from niche products to main stream, and are today the fastest growing segment in ultrasound.

LISTED UNDER: Ceramics | Crystals

Spectrum's New Extruded Ceramic Tubular Capacitors Enhance Design Flexibility

June 27, 2011 8:49 am | Wireless Design & Development | Product Releases | Comments

Spectrum Advanced Specialty Products has added an extrusion process to their current manufacturing methods of ceramic tubular capacitors. The addition of this process enhances Spectrum's design flexibility with an increased custom product offering. Spectrum is now capable of producing sizes of up to 1" in length as well as diameters of ½" and larger.

LISTED UNDER: Passives, Capacitors | Ceramics

Richardson RFPD Selected as Sole Distributor for ATC Ultra-Broadband 506WLC Series Inductors

June 15, 2011 6:06 am | Wireless Design & Development | Product Releases | Comments

Richardson RFPD announced it has been selected by American Technical Ceramics (ATC) as the global exclusive distributor for the new 506WLC Series of Ultra-Broadband Inductors. This select group of inductors has been engineered with a powdered iron ferrite core and gold plated terminations to provide reliable and repeatable ultra-broadband performance beyond 40 GHz.

LISTED UNDER: Passives, Inductors | Ceramics

New Phase Change Material Expands Company’s Thermal Interface Materials Product Line

April 22, 2011 7:31 am | Product Releases | Comments

Laird Technologies, Inc. announced the release of its new Tpcm™ 580SP Series phase change material. The Tpcm™ 580SP Series is the latest phase change material (PCM) offered in Laird Technologies’ thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4....

LISTED UNDER: Substrates

New Phase Change Material Expands Company’s Thermal Interface Materials Product Line

April 22, 2011 7:31 am | Product Releases | Comments

Laird Technologies, Inc. announced the release of its new Tpcm™ 580SP Series phase change material. The Tpcm™ 580SP Series is the latest phase change material (PCM) offered in Laird Technologies’ thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4....

LISTED UNDER: Substrates
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High Temperature Resistant, Toughened Structural Adhesive Cures at Room Temperature

January 19, 2011 6:45 am | Wireless Design & Development | Product Releases | Comments

Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics....

LISTED UNDER: Ceramics

Rogers to Display Advanced Materials for Defense Applications at DMC 2010

November 22, 2010 8:47 am | Product Releases | Comments

Rogers Corporation will be highlighting a blend of proven and new materials solutions at the upcoming Defense Manufacturing Conference 2010 (DMC 2010) later this month (Nov. 29 - Dec. 1, to be held at The Venetian, in Las Vegas, NV).   Representatives from Rogers Advanced Circuit Materials (ACM) Division will be available at Booth #1001 to discuss such reliable and tested high-performance materials as RT/duroid® 6202PR and RT/duroid 5880L...

LISTED UNDER: Substrates

UTAF Piezo Motor Being Commercialized in Next-Gen Smart Phone Cameras

November 19, 2010 9:46 am | Wireless Design & Development | Product Releases | Comments

New Scale Technologies, Inc. has received its fifth U.S. patent for miniature piezoelectric motor technology. Trade-named the UTAF motor (for Ultra-Thin Auto Focus, its target application), the tiny new device integrates all ultrasonic motor functions into a single piezoelectric ceramic beam measuring only 4....

LISTED UNDER: Ceramics

Combination of Materials, Fabrication and Test Expertise Deliver LCP Laminates with Exceptional Performance and Proven Reliability

November 4, 2010 9:46 am | Product Releases | Comments

Endicott Interconnect Technologies, Inc. (EI) announced recently that the company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits....

LISTED UNDER: Substrates | Services, Calibration / Test

Spheric Technologies Produces Lithium Battery Materials Cheaper and Faster with Microwave Furnace Systems

August 30, 2010 10:06 am | Product Releases | Comments

PHOENIX, /PRNewswire/ -- Lithium batteries are playing a central role in the new energy economy, powering everything from cell phones to electric cars. New research shows that pricey lithium battery materials can be produced cheaper and faster using industrial microwave furnace systems. Spheric Technologies, a Phoenix, Arizona, high temperature microwave technology innovator, has developed a time- and cost-saving production process for a...

LISTED UNDER: Substrates | Power, Batteries | Power, Battery

Technologically Advanced RF, Microwave, and mmW Surface-Mount Capacitor

August 20, 2010 7:58 am | Wireless Design & Development | Product Releases | Comments

Available from Richardson Electronics, the 550L Series UBCTM (Ultra-Broadband) Capacitor from American Technical Ceramics (ATC) provides reliable and repeatable Ultra-Broadband performance from 16 kHz to over 40 GHz. Desired features include: •Defense/Aerospace Extended Operating Temp. Range (-55ºC to +125ºC) •One-piece, Orientation-Insensitive Package (Rugged Ceramic Construction) •Ultra-low Insertion Loss ( •Flat Frequency Resp...

LISTED UNDER: Ceramics

Capacitors Allow Designers to Reduce their Component Count and Shrink Board Space

August 6, 2010 9:26 am | Wireless Design & Development | Product Releases | Comments

AVX Corporation has expanded on its widely popular switch mode power supply (SMPS) capacitors series, TurboCap™. These capacitors allow designers to reduce their component count, shrink board space and maintain the benefits of ceramics such as low ESR/ESL, ability to withstand transients and the ability to handle large amounts of power in an efficient and compact package....

LISTED UNDER: Ceramics

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