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ERGO-CASE ‘XS’ - OKWs Wearable Small Hand Held Enclosures

February 19, 2013 9:20 am | by WDD Staff | Product Releases | Comments

OKW Enclosures has extended its advanced ERGO-CASE enclosures system with six new smaller size ‘XS’ models. The new models are ideal for compact hand held electronic devices, and have an ergonomically contoured design, which is very comfortable to hold or wear.

LISTED UNDER: Ceramics | Substrates
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Saelig Introduces BoardMaster Universal PCB Test System

January 30, 2013 10:22 am | by WDD Staff | Product Releases | Comments

Saelig Company, Inc. has introduced the ABI BoardMaster 8000 PLUS - a unique, versatile, self-contained, and easy-to-use PCB test system. The BoardMaster 8000 Plus is a comprehensive set of test instruments, complete with built-in PC, for testing and fault-finding on almost any kind of PCB.

LISTED UNDER: Ceramics | Substrates | Test and Measurement, Analyzers, Spectrum

Fujipoly’s Thermal Gel Sheets

January 30, 2013 9:52 am | by WDD Staff | Product Releases | Comments

Fujipoly (Carteret, NJ) has announced the availability of Sarcon 50GR-Ae, an extremely soft, .5 mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink.

LISTED UNDER: Boards & Modules | Ceramics | Substrates

Ceramic Fasteners Designed for High Temperature, High Voltage Applications

October 4, 2012 5:29 am | Wireless Design & Development | Product Releases | Comments

The Goodfellow Ceramic and Glass Division has added to its new website a range of ceramic nuts, bolts and washers for applications where high temperature, high voltages, magnetism or harsh conditions greatly limit or prohibit the use of other materials. The ceramic fasteners are of high purity, fully dense and impervious.

LISTED UNDER: Ceramics

Halogen-free Theta circuit materials ideally suited for high-speed digital circuits

August 9, 2012 7:49 am | Product Releases | Comments

  Rogers Corporation  will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference ) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.

LISTED UNDER: Substrates

Low-cost, Improved Performance and Quality of Metallized Ceramic Substrates

April 23, 2012 10:29 am | by Posted Janine E. Mooney, Editor | Wireless Design & Development | Product Releases | Comments

Remtec has added a new universal finish of Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) as a standard finish to its umbrella of fabrication methods.  The new finish resolves a problem of intermetalics detrimental to the reliability of solder joints (black pad formations) and wire bonding connections.

LISTED UNDER: Ceramics

Renewable Raw Materials - The Future of Plastic Enclosures

February 3, 2012 3:40 am | Product Releases | Comments

On request, OKW now offers its design-oriented standard plastic enclosures in a bioplastic material. This biomaterial is entirely manufactured from renewable raw materials and is formulated to replace the fossil plastics currently being used. Unlike conventional raw materials, bioplastics are largely CO2-neutral, irrespective of their subsequent utilization.

LISTED UNDER: Substrates

Application and Theory of Dielectric Materials in RF/Microwave Systems

January 18, 2012 5:50 am | Product Releases | Comments

Maxwell’s equations define two terms which determine the response of a material to electromagnetic fields. These are the electric permittivity e and the magnetic permeability µ. If these quantities are known for a material, then the reaction of a wave to the material is completely determined. The permeability is a measure of a material’s response to the magnetic portion of an EM wave....

LISTED UNDER: Substrates

Poly-Form Flexible Pre-shaped Adhesives for Bonding Diverse Materials

September 2, 2011 8:44 am | Product Releases | Comments

Multi-Seals has introduced an innovative alternative to liquid adhesives for component assembly. Multi-Seals F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. F05 has negligible vertical flow, which keeps the adhesive contained in precisely defined areas.

LISTED UNDER: Substrates

Antenna-Grade Materials Solutions will Showcase at Antenna Systems 2011

August 31, 2011 7:26 am | by Edited Janine E. Mooney, Associate Editor | Product Releases | Comments

Rogers Corporation will be showcasing its high performance, cost-effective laminate materials for antenna applications at the upcoming Antenna Systems 2011 Conference and Expo September 20-21, at the Gaylord Opryland Hotel, Nashville, TN. Antenna Systems 2011 is a leading international conference and exhibition devoted to antenna designers, manufacturers, and system integrators focusing on the latest advances in antenna systems and technology.

LISTED UNDER: Substrates

Enabling Technology for Tomorrow’s Ultrasound Imaging

July 12, 2011 7:15 am | Wireless Design & Development | Product Releases | Comments

By Chester Kaufman, STMicroelectronics Development Engineer - Medical In recent years, the landscape of ultrasound imaging technology has changed dramatically due to advancements in semiconductor and transducer technology. For instance, hand-carried ultrasound products have gone from niche products to main stream, and are today the fastest growing segment in ultrasound....

LISTED UNDER: Ceramics | Crystals

Enabling Technology for Tomorrow’s Ultrasound Imaging

July 12, 2011 7:15 am | Wireless Design & Development | Product Releases | Comments

By Chester Kaufman, STMicroelectronics Development Engineer - Medical In recent years, the landscape of ultrasound imaging technology has changed dramatically due to advancements in semiconductor and transducer technology. For instance, hand-carried ultrasound products have gone from niche products to main stream, and are today the fastest growing segment in ultrasound.

LISTED UNDER: Ceramics | Crystals

Spectrum's New Extruded Ceramic Tubular Capacitors Enhance Design Flexibility

June 27, 2011 8:49 am | Wireless Design & Development | Product Releases | Comments

Spectrum Advanced Specialty Products has added an extrusion process to their current manufacturing methods of ceramic tubular capacitors. The addition of this process enhances Spectrum's design flexibility with an increased custom product offering. Spectrum is now capable of producing sizes of up to 1" in length as well as diameters of ½" and larger.

LISTED UNDER: Passives, Capacitors | Ceramics

Richardson RFPD Selected as Sole Distributor for ATC Ultra-Broadband 506WLC Series Inductors

June 15, 2011 6:06 am | Wireless Design & Development | Product Releases | Comments

Richardson RFPD announced it has been selected by American Technical Ceramics (ATC) as the global exclusive distributor for the new 506WLC Series of Ultra-Broadband Inductors. This select group of inductors has been engineered with a powdered iron ferrite core and gold plated terminations to provide reliable and repeatable ultra-broadband performance beyond 40 GHz.

LISTED UNDER: Passives, Inductors | Ceramics

New Phase Change Material Expands Company’s Thermal Interface Materials Product Line

April 22, 2011 7:31 am | Product Releases | Comments

Laird Technologies, Inc. announced the release of its new Tpcm™ 580SP Series phase change material. The Tpcm™ 580SP Series is the latest phase change material (PCM) offered in Laird Technologies’ thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4....

LISTED UNDER: Substrates

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