Suppress-n-Sink RF Absorber/Thermally Conductive Pad

December 12, 2013 4:54 pm | by WDD Staff | Product Releases | Comments

RFMW announced design and sales support for a new line of dual use RF Absorber + Thermally Conductive pad material from MAST Technologies. Trademarked Suppress-n-Sink, the target application is reducing harmful reflections from heat-sinks and heat-spreaders...

LISTED UNDER: Ceramics | Substrates

Elma's Custom-designed Type 15i Instrument Case

December 9, 2013 5:37 pm | by WDD Staff | Product Releases | Comments

Elma Electronics introduced a new Type 15i instrument case that is scalable in all three dimensions (H x W x D), while offering designers cost-effective, custom-sized enclosures in relatively small volumes. With virtually infinite scalability in an attractive package, the new enclosure can be sized perfectly to house instruments or small portable devices...

LISTED UNDER: Ceramics | Substrates

MLF / MLFM MELFs Provide Lower Heat Rise

November 26, 2013 5:01 pm | by WDD Staff | Product Releases | Comments

The MLF/MLFM Series surface mount metal film from Stackpole offers cooler operating temperatures at full rated power...

LISTED UNDER: Boards & Modules | Ceramics | Substrates

AVX Adds Harsh Environment MLCC Series

October 29, 2013 3:19 pm | by WDD Staff | Product Releases | Comments

SpiCalci 8.0 now features SXP- & SMX-style MLCCs rated for up to 200°C & ideal for down-hole oil exploration, space, aerospace, & hybrid automotive applications...

LISTED UNDER: Ceramics | Passives, Capacitors | Software, Other

Thermally-Conductive Polymer from Carbodeon

October 29, 2013 11:29 am | by WDD Staff | Product Releases | Comments

Carbodeon has developed a thermal filler using nanodiamonds that increase the conductivity of thermally conductive polymers by 25 percent, providing significant performance increases for polymers used in electronics and LED manufacture...

LISTED UNDER: IC | Components, Other | Substrates

Bud Industries’ Board-Ganizer Enclosure Provides a Stow-Away Workspace

October 22, 2013 11:41 am | by WDD Staff | Product Releases | Comments

Bud Industries has announced a solution to the problem of organizing multiple development boards and a maze of wiring. Using a revolutionary “flat or folded” approach, the patent-pending Board-ganizer enclosure provides a tidy work platform, keeps components of a design project in one place, and makes breadboarded...

LISTED UNDER: Boards & Modules | Ceramics | Substrates

Molex Subsidiary Polymicro Improves FDP Optical Fiber For Deep UV Applications

September 18, 2013 10:57 am | by WDD Staff | Product Releases | Comments

Polymicro recently announced improvements to its FDP optical fiber. The latest enhancements improve solarization of the fiber in deep UV applications (190 to 325 nm).

LISTED UNDER: Components, Other | Ceramics | Substrates

Cylinder Connection Cover Protects Gas Technicians from Harmful Gas Exposure

September 11, 2013 4:21 pm | by WDD Staff | Product Releases | Comments

SEMI-GAS Systems offers a controller-activated cylinder connection cover that enhances safety in gas delivery environments.

LISTED UNDER: Ceramics | Substrates

RFMW Supports 150 W Termination from EMC Technology

August 28, 2013 5:03 pm | by WDD Staff | Product Releases | Comments

RFMW has announced design and sales support for a small profile, high power termination from EMC Technology. Employing an Aluminum Nitride substrate, the SMT252503ALN2F handles up to 150 W.

LISTED UNDER: Substrates

Biodegradable Hand Held Enclosures from Stock

August 27, 2013 12:25 pm | by WDD Staff | Product Releases | Comments

The Soft-case series of hand held enclosures from OKW is now available from stock molded in Biograde bioplastic material. Biograde is a CO2 neutral material, technically compostable and biodegradable, and has similar mechanical and physical properties to ABS.

LISTED UNDER: Ceramics | Substrates

Hammond’s New HJ Series Ticks all the Boxes

August 8, 2013 9:21 pm | by WDD Staff | Product Releases | Comments

Hammond Manufacturing has introduced its new HJ H Series, a family of hinged cover metal enclosures, environmentally sealed to NEMA Type 3R, 4 (IP66), 12, and 13.

LISTED UNDER: Ceramics | Substrates

White Body LED Protectors from Littelfuse Enhance Overall Light Engine Efficiency

August 4, 2013 7:08 pm | by WDD Staff | Product Releases | Comments

Littelfuse has introduced an addition to the company’s PLED Open LED protection devices line. The PLEDxSW Series LED Protector, unlike earlier PLED devices from Littelfuse that had black molded bodies, is molded from a white material, which makes it less noticeable in LED fixtures, particularly for indoor applications.

LISTED UNDER: Electromechanical / Mechanical | Ceramics | Substrates

Gore’s New Series VE9 Adhesive Vent Extends Life of Outdoor Electronic Enclosures

July 25, 2013 3:35 pm | by WDD Staff | Product Releases | Comments

W. L. Gore & Associates has expanded its line of GORE Protective Vents with a new product specifically engineered to increase the reliability of outdoor electronic enclosures that are commonly exposed to changing weather and environmental conditions.

LISTED UNDER: Ceramics | Substrates

OKWs Wearable Small Hand Held Enclosures

July 11, 2013 1:41 pm | by WDD Staff | Product Releases | Comments

OKW has extended its advanced ERGO-CASE enclosures system with six new smaller sized ‘XS’ models. The new models are ideal for compact hand-held electronic devices, and have an ergonomically contoured design, which is comfortable to hold or wear. 

LISTED UNDER: Ceramics | Substrates

HEYCo-molded Liquid Tight Break-Thru Plugs

June 28, 2013 3:38 pm | by WDD Staff | Product Releases | Comments

HEYCo has introduced co-molded nylon and elastomer parts, which function as Liquid Tight Plugs. The plugs have an IP67/68 rating, yet can be pierced by round wire, cable or tubing to function as Liquid Tight Bushings with the same resulting IP67/68 rating.

LISTED UNDER: Ceramics | Substrates


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