Fujipoly’s Thermal Gel Sheets
January 30, 2013 9:52 am | by WDD Staff | Product Releases | CommentsFujipoly (Carteret, NJ) has announced the availability of Sarcon 50GR-Ae, an extremely soft, .5 mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink.
LISTED UNDER: Boards & Modules | Ceramics | Substrates
Smart TVs and Unmanned Cars
January 28, 2013 11:25 am | by Eric Sorensen, Coordinator of Multimedia Development | Videos | CommentsNew from Electronic Component News is the very first episode of our Engineering Update newscast, brought to you by Mouser Electronics. In this episode, we talk about smart TVs and unmanned cars from CES; and a pill-sized device for imaging the esophagus.
LISTED UNDER: Amplifiers | Antennas | ICSHalogen-free Theta circuit materials ideally suited for high-speed digital circuits
August 9, 2012 7:49 am | Product Releases | CommentsRogers Corporation will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference ) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.
LISTED UNDER: SubstratesRenewable Raw Materials - The Future of Plastic Enclosures
February 3, 2012 3:40 am | Product Releases | CommentsOn request, OKW now offers its design-oriented standard plastic enclosures in a bioplastic material. This biomaterial is entirely manufactured from renewable raw materials and is formulated to replace the fossil plastics currently being used. Unlike conventional raw materials, bioplastics are largely CO2-neutral, irrespective of their subsequent utilization.
LISTED UNDER: SubstratesApplication and Theory of Dielectric Materials in RF/Microwave Systems
January 18, 2012 5:50 am | Product Releases | CommentsMaxwell’s equations define two terms which determine the response of a material to electromagnetic fields. These are the electric permittivity e and the magnetic permeability µ. If these quantities are known for a material, then the reaction of a wave to the material is completely determined. The permeability is a measure of a material’s response to the magnetic portion of an EM wave....
LISTED UNDER: SubstratesPoly-Form Flexible Pre-shaped Adhesives for Bonding Diverse Materials
September 2, 2011 8:44 am | Product Releases | CommentsMulti-Seals has introduced an innovative alternative to liquid adhesives for component assembly. Multi-Seals F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. F05 has negligible vertical flow, which keeps the adhesive contained in precisely defined areas.
LISTED UNDER: SubstratesAntenna-Grade Materials Solutions will Showcase at Antenna Systems 2011
August 31, 2011 7:26 am | by Edited Janine E. Mooney, Associate Editor | Product Releases | CommentsRogers Corporation will be showcasing its high performance, cost-effective laminate materials for antenna applications at the upcoming Antenna Systems 2011 Conference and Expo September 20-21, at the Gaylord Opryland Hotel, Nashville, TN. Antenna Systems 2011 is a leading international conference and exhibition devoted to antenna designers, manufacturers, and system integrators focusing on the latest advances in antenna systems and technology.
LISTED UNDER: SubstratesNew Phase Change Material Expands Company’s Thermal Interface Materials Product Line
April 22, 2011 7:31 am | Product Releases | CommentsLaird Technologies, Inc. announced the release of its new Tpcm™ 580SP Series phase change material. The Tpcm™ 580SP Series is the latest phase change material (PCM) offered in Laird Technologies’ thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4....
LISTED UNDER: SubstratesNew Phase Change Material Expands Company’s Thermal Interface Materials Product Line
April 22, 2011 7:31 am | Product Releases | CommentsLaird Technologies, Inc. announced the release of its new Tpcm™ 580SP Series phase change material. The Tpcm™ 580SP Series is the latest phase change material (PCM) offered in Laird Technologies’ thermal interface material (TIM) product line. It is an exceptionally high-performance, screen printable or stencilable TIM with a thermal conductivity of 4....
LISTED UNDER: SubstratesRogers to Display Advanced Materials for Defense Applications at DMC 2010
November 22, 2010 8:47 am | Product Releases | CommentsRogers Corporation will be highlighting a blend of proven and new materials solutions at the upcoming Defense Manufacturing Conference 2010 (DMC 2010) later this month (Nov. 29 - Dec. 1, to be held at The Venetian, in Las Vegas, NV). Representatives from Rogers Advanced Circuit Materials (ACM) Division will be available at Booth #1001 to discuss such reliable and tested high-performance materials as RT/duroid® 6202PR and RT/duroid 5880L...
LISTED UNDER: SubstratesCombination of Materials, Fabrication and Test Expertise Deliver LCP Laminates with Exceptional Performance and Proven Reliability
November 4, 2010 9:46 am | Product Releases | CommentsEndicott Interconnect Technologies, Inc. (EI) announced recently that the company has added LCP Laminates to its family of microelectronics packaging product offerings. Custom designed LCP Laminates are suitable for semiconductor packages as LCP coreless designs for up to 6 layers as well as in combination with other rigid materials as hybrid circuits....
LISTED UNDER: Substrates | Services, Calibration / TestSpheric Technologies Produces Lithium Battery Materials Cheaper and Faster with Microwave Furnace Systems
August 30, 2010 10:06 am | Product Releases | CommentsPHOENIX, /PRNewswire/ -- Lithium batteries are playing a central role in the new energy economy, powering everything from cell phones to electric cars. New research shows that pricey lithium battery materials can be produced cheaper and faster using industrial microwave furnace systems. Spheric Technologies, a Phoenix, Arizona, high temperature microwave technology innovator, has developed a time- and cost-saving production process for a...
LISTED UNDER: Substrates | Power, Batteries | Power, BatteryPackages Tout Complete Characterization and Microcharacterization of Carbon Nanomaterials
July 28, 2010 11:11 am | Product Releases | CommentsThermo Fisher Scientific Inc announced the availability of two new DXR Nanocarbon Analysis Packages for the characterization and microcharacterization of carbon nanomaterials. Both packages offer large-scale chemical and materials producers complete systems for carbon nanotube analysis. Incorporating the Thermo Scientific DXR Raman platform, the packages provide information on the molecular structure and morphology of carbon nanomaterials....
LISTED UNDER: SubstratesDOE Awards Second Contract for Inspection of Infrared Materials and Products
July 22, 2009 9:32 am | Product Releases | CommentsSARASOTA, Fla. and BOLINGBROOK, Ill., /PRNewswire-FirstCall/ -- Sunovia Energy Technologies, Inc. and its partner EPIR Technologies, Inc. announced today the United States Department of Energy has awarded a second contract to EPIR Technologies to provide improved infrared (IR) detectors to be used in a new generation of tools for the inspection and characterization of infrared materials and products....
LISTED UNDER: SubstratesIntegrated Receiver Modules Use Low-cost Materials and Automated Processes
May 26, 2009 6:59 am | Product Releases | CommentsMMIC Solutions Ltd. announces the first shipment of its MSx600 range of integrated receiver modules. MMIC Solutions designs and manufactures small, low cost millimeter wave radio products for high capacity communications, security and defense applications. The company's advanced technology allows these products to be manufactured using low-cost circuit board materials and automated processes.
LISTED UNDER: Boards & Modules | Substrates
