Integrated Components
An Electrical Switch for Magnetism
May 31, 2013 9:33 am | by David L. Chandler, MIT News Office | News | CommentsResearchers at MIT have developed a new way of controlling the motion of magnetic domains — the key technology in magnetic memory systems, such as a computer’s hard disk. The new approach requires little power to write and no power to maintain the stored information, and could lead to a new generation of extremely low-power data storage.
LISTED UNDER: Memory | Power | SemiconductorsSanDisk Advances Its Manufacturing Technology
May 29, 2013 12:52 pm | by SanDisk Corporation | News | CommentsSanDisk Corporation [NASDAQ: SNDK] has announced it has begun customer sampling of flash memory products based on its industry-leading 1Ynm process technology, which represents its second generation 19 nanometer (nm) manufacturing technology.
LISTED UNDER: MemoryFacial Recognition Technology Proves its Mettle
May 28, 2013 4:20 pm | by Tom Oswald, Michigan State University | News | CommentsIn a study that evaluated some of the latest in automatic facial recognition technology, researchers at Michigan State University were able to quickly identify one of the Boston Marathon bombing suspects from law enforcement video, an experiment that demonstrated the value of such technology.
LISTED UNDER: Electromechanical / Mechanical | Embedded Systems & Networking | ICS
Innovation Could Bring Flexible Solar Cells, Transistors, Displays
May 23, 2013 10:19 am | by Emil Venere, Purdue University | News | CommentsResearchers have created a new type of transparent electrode that might find uses in solar cells, flexible displays for computers and consumer electronics and future "optoelectronic" circuits for sensors and information processing. The electrode is made of silver nanowires covered with a material called graphene, an extremely thin layer of carbon. The hybrid material shows promise as a possible replacement...
LISTED UNDER: Boards & Modules | Electromechanical / Mechanical | Embedded Systems & Networking
RFMW Introduces 400-Micron Discrete FET
May 16, 2013 11:48 am | by WDD Staff | Product Releases | CommentsRFMW, Ltd. announces a discrete 400-Micron GaAs pHEMT FET. Designed using TriQuint’s proven 0.25 um pHEMT process, power, and efficiency at high-drain bias operating conditions are optimized. The TriQuint TGF2040 allows self-biasing and eliminates the need for a negative supply voltage.
LISTED UNDER: Amplifiers, Other | GaAs / FET / IC | Components, Other
Stackpole’s RNCP Series for High Power Anti-Sulfur Applications
May 13, 2013 4:04 pm | by WDD Staff | Product Releases | CommentsThe RNCP series from Stackpole has no silver or other susceptible metals in the terminations to cause sulfur contamination. Additional features include applicability in automotive and industrial control applications, construction and heavy equipment, power supplies, and anywhere sulfur contamination is a concern.
LISTED UNDER: Components, Other | Interconnect, Connectors | Switches, IC
KAIST's Vivo Flexible Large Scale Integrated Circuits
May 7, 2013 9:23 am | by The Korea Advanced Institute of Science and Technology (KAIST) | News | CommentsA team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.
LISTED UNDER: Circuits, Space | Circuits, Thick Film | Circuits, Thin Film
Molex’s Next-Gen, High-Performance Memory Technology
May 7, 2013 8:05 am | by WDD Staff | Product Releases | CommentsMolex Inc. has introduced a portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets, both of which are ideal for demanding memory applications in telecommunication, networking and storage systems, advanced computing platforms, industrial controls, and medical equipment.
LISTED UNDER: Memory, DRAM | Memory, Embedded | Memory, Flash
Sensor-Specific Solutions Include App Software
May 3, 2013 10:00 am | by WDD Staff | Product Releases | CommentsData Translation, Inc. has announced two sensor specific, USB-powered modules with application software for the growing educational market. These new devices allow lab and field testing for experimentation, sound, vibration, and temperature analysis. The DT9828E, USB thermocouple module features...
LISTED UNDER: Components, Other | Memory, DRAM | Memory, Embedded
GORE Automotive Vents Protect Powertrain Components
April 30, 2013 9:52 am | by WDD Staff | Product Releases | CommentsW. L. Gore & Associates has expanded its line of GORE Automotive Vents to include the new Series: AVS 41 (P/N VE2048) venting solution, which is engineered specifically for powertrain components. This new vent improves component reliability by equalizing pressure, preventing contamination from water...
LISTED UNDER: Components, Other | Ceramics | Substrates
Battery and Memory Device in One
April 25, 2013 9:31 am | by Prof. Rainer Waser, Jülich Aachen Research Alliance (JARA) | News | CommentsResistive memory cells (ReRAM) are regarded as a promising solution for future generations of computer memories. They will dramatically reduce the energy consumption of modern IT systems while significantly increasing their performance. Unlike the building blocks of conventional hard disk drives and memories...
LISTED UNDER: Electromechanical / Mechanical | Embedded Systems & Networking | Memory, DRAM
PV Connector from Amphenol UL Certified to 1000 V
April 22, 2013 11:55 am | by WDD Staff | Product Releases | CommentsAmphenol Industrial Global Operations announced that its Helios H4 is UL certified to 1000 V. This UL rating allows Amphenol’s connectors to be used in existing systems as well as in new ones that require more voltage without having to increase cable size.
LISTED UNDER: IC | Components, Other | Interconnect, ConnectorsWireless "Smart Skin" Sensors Could Provide Remote Monitoring of Infrastructure
April 17, 2013 9:57 am | by John Toon, Georgia Institute of Technology | News | CommentsMajor bridge failures in recent years have focused attention on the need to monitor America’s highway bridges and other infrastructure. As thousands of bridges, parking garages and other structures age, improved methods for detecting deterioration could save lives and prevent economic disruption.
LISTED UNDER: Boards & Modules | Computing | Chipsets, RF
API's WIRELINE & WIREPAC Quadrature Couplers
April 17, 2013 9:04 am | by WDD Staff | Product Releases | CommentsAPI Technologies Corp. has announced it is now offering design patented WIRELINE and WIREPAC quadrature couplers. WIRELINE and WIREPAC couplers consist of a pair of wire center conductors surrounded by a continuous dielectric insulator and shielded by a drawn or extruded outer jacket.
LISTED UNDER: Industrial | Components, Other | Transmitters, Other
Honeywell Introduces Limitless Wireless Non-Contact Switch
April 16, 2013 9:27 am | by WDD Staff | Product Releases | CommentsHoneywell [NYSE:HON] has announced that it has expanded its Limitless Wireless Solutions portfolio with the introduction of its new Limitless Non-Contact Switch WLS Series. The new WLS Series switch features harsh-duty packaging.
LISTED UNDER: Components, Other | Switches, IC | Telecommunications
