FREE WDD Email Newsletter
HAN GND – Now a Pluggable Ground Connector
April 4, 2013 11:02 am | by WDD Staff | Product Releases | CommentsHARTING’s Han GND (Han-Ground) new connector series makes it possible to create grounding systems with pluggable connections. The Han GND, is a single-pole, slim design connector that features a robust green and yellow plastic (polycarbonate) housing and module.
LISTED UNDER: IC | Components, Other | Interconnect, Connectors
Quantum Tricks Drive Magnetic Switching into the Fast Lane
April 4, 2013 10:22 am | by Ames Laboratory | News | CommentsResearchers at the U.S. Department of Energy’s Ames Laboratory, Iowa State University, and the University of Crete in Greece have found a new way to switch magnetism that is at least 1,000 times faster than currently used in magnetic memory technologies. Magnetic switching is used to encode information in hard drives ...
LISTED UNDER: Consumer | IC | Components, OtherDon't Call it Vaporware: Scientists Use Cloud of Atoms as Optical Memory Device
April 4, 2013 9:42 am | by Joint Quantum Institute, National Institute of Standards and Technology | News | CommentsScientists at the Joint Quantum Institute of the National Institute of Standards and Technology and the University of Maryland have taken this to a whole new level by demonstrating* that they can store visual images within quite an ethereal memory device—a thin vapor of rubidium atoms.
LISTED UNDER: Computing | Embedded Systems & Networking | Memory, DRAM
Cypress’ PSoC 4 Architecture
March 29, 2013 9:50 am | by WDD Staff | Product Releases | CommentsCypress Semiconductor Corp. [NASDAQ: CY] has unveiled the PSoC 4 programmable system-on-chip architecture, which combines Cypress’s best-in-class PSoC analog and digital fabric and industry-leading CapSense capacitive touch technology with ARM’s power-efficient Cortex-M0 core.
LISTED UNDER: Circuits, SOC | Components, Other | Receivers, Other
IAR Systems Enhances Embedded Workbench
March 26, 2013 11:25 am | by WDD Staff | Product Releases | CommentsIAR Systems (Sweden) has released a new version of its development tool suite IAR Embedded Workbench for Renesas RL78. The new version 1.30 adds a large amount of new functionality for code writing and debugging.
LISTED UNDER: Transmission, Other | Development Kits / Platforms | Components, Other
SFF Signal Processing Platform Expands VPX Ecosystem
March 25, 2013 12:48 pm | by WDD Staff | Product Releases | CommentsElma Electronic Inc. (Fremont, CA), in cooperation with Pentek, Inc. (Upper Saddle River, NJ) and Concurrent Technologies (Woburn,MA), has developed a small form factor (SFF), OpenVPX-based signal acquisition system for processing and recording applications.
LISTED UNDER: Circuits, Mixed Signal | Components, Other
LCR Electronics' EC1032 Electronic Controls
March 25, 2013 12:41 pm | by WDD Staff | Product Releases | CommentsLCR Electronics Inc. has announced their EC1032 electronic controls. In conjunction with an available potentiometer assembly, the EC1032 is an inexpensive, simple, and flexible way to incorporate a new feature into applications including fluid pumps, fans, small appliances, lighting, heating, equipment cooling, humidity control, and exhaust ventilators.
LISTED UNDER: Components, Other | Interconnect, Cables | Power, Controllers
Fantastic Flash Memory Combines Graphene and Molybdenite
March 20, 2013 10:38 am | by Ecole Polytechnique Fédérale de Lausanne | News | CommentsEPFL scientists have combined two materials with advantageous electronic properties -- graphene and molybdenite -- into a flash memory prototype that is very promising in terms of performance, size, flexibility and energy consumption.
LISTED UNDER: Memory, DRAM | Memory, Embedded | Memory, Flash
RF MEMS Switch: What You Need to Know
March 19, 2013 10:25 am | by OMRON | White PapersOMRON’s MEMS switch has a SPDT（Single Pole Double Throw） contact configuration. Two MEMS chips that have a SPST (Single Pole Single Throw） contact configuration are installed on the ceramic package using the flip chip bonding method as shown Figure 1.
LISTED UNDER: IC | Components, Other | Switches, IC
Binder Expands Connector Series
March 18, 2013 10:58 am | by WDD Staff | Product Releases | CommentsBinder-USA has expanded its Series 768 and 718 M8 product line with new 8-pin panel-mount receptacles. The receptacles provide an ideal solution for applications requiring high pin numbers in areas with limited space. The connectors are commonly used for sensors and actuators...
LISTED UNDER: IC | Components, Other | Interconnect, ConnectorsNetlist Expands IP Portfolio with Newly Issued Patents
March 15, 2013 5:06 pm | by Netlist, Inc. | News | CommentsThe newly-issued patents address growing technical bottlenecks in the area of high-density server memory. As density progression of monolithic DRAMs slows, server memory solutions will increasingly require technologies that can integrate a greater number of existing
LISTED UNDER: Memory, DRAM | Memory, Embedded | Memory, Flash
Creating Indestructible Self-Healing Circuits
March 12, 2013 9:23 am | by California Institute of Technology | News | CommentsImagine that the chips in your smart phone or computer could repair and defend themselves on the fly, recovering in microseconds from problems ranging from less-than-ideal battery power to total transistor failure. It might sound like the stuff of science fiction...
LISTED UNDER: Consumer | IC | Circuits, Comparators
Ironwood Electronics' New High-Performance QFP Socket
March 1, 2013 8:46 am | by WDD Staff | Product Releases | CommentsIronwood Electronics has introduced a new high-performance QFP socket for 0.4 mm pitch 128 pin QFP. The SG-QFE-7011 socket features a14 x 14 x 1.6 mm package size with 16 x 16 mm lead tip to tip and bandwidths up to 10 GHz with less than 1dB of insertion loss.
LISTED UNDER: Circuits, Comparators | Circuits, Mil-Spec | Circuits, Mixed Signal
Lantronix Launches xPico Wi-Fi Device Server
February 27, 2013 9:29 am | by WDD Staff | Product Releases | CommentsLantronix, Inc. [NASDAQ: LTRX] has announced the launch of its new xPico Wi-Fi module, a compact, embedded wireless device server designed for easy and fast serial-to-Wi-Fi connectivity. The xPico Wi-Fi device features afootprint of 24 x 16.5 mm.
LISTED UNDER: Components, Other | Digital Hardware, Other | Digital Hardware, Signal ProcessingIAR Systems Launches Technical Training offering IAR Academy
February 26, 2013 3:13 pm | by IAR Systems | News | CommentsIAR Systems has announced the launch of IAR Academy, an educational offering aimed at new as well as experienced users of IAR Embedded Workbench, the world-leading development tool suite for embedded applications.
LISTED UNDER: Computing | Consumer | Components, Other
