After three years of deliberation, the IEEE802.16m air interface definition will be ready for prime time in the next few months. This critical step toward creating true 4G cellular technology based on WiMAX is important enough to earn compliant products a new name: WiMAX 2. Further proof came last month, when an impressive subset of the WiMAX community created the WiMAX 2 Collaboration Initiative to "improve the economics of mobile broadband" and "to create a better value chain for service providers.
SiGe Semiconductor’s SE2601T is a RF switch/LNA front-end IC (FEIC) designed to enhance the performance and functionality of converged Bluetooth™/Wi-Fi™ chipsets for embedded applications. The device addresses the increasing convergence of connectivity requirements such as Wi-Fi™ and Bluetooth™ for the new generations of smartphones, netbooks, personal media players and digital cameras....LISTED UNDER: Chipsets, Other
Santa Clara, Calif. – Amimon announced that it has surpassed half a million units in chipset sales and orders. The company has been experiencing very strong and rapidly growing demand for its wireless 1080p WHDI™ (Wireless Home Digital Interface)™ chipset. With a very strong first quarter and multiple new WHDI products to be launched in the next few months, Amimon is on track to crossing the one million chipset sales milestone by Holiday S...LISTED UNDER: Chipsets, Other
The Emergence of JESD204A in Data Converters and Low Power FPGAs in Wireless Infrastructure EquipmentApril 14, 2010 12:12 pm | Articles | Comments
The increasing data throughput demands on base stations have led to increased radio unit component cost and power, with associated printed circuit board and interface complexities, as well as heightened signal integrity concerns.
By Brian Blum, Texas Instruments Bluetooth Low Energy (BLE) is fast-becoming the hottest buzz-word in low-power wireless communications. Within five years, we have seen a variety of standard and proprietary networking protocols emerge, begin to show promise, and occasionally open up new market spaces and fundamental opportunities for technical innovation.
By Brian Blum, Texas Instruments Bluetooth Low Energy (BLE) is fast-becoming the hottest buzz-word in low-power wireless communications. Within five years, we have seen a variety of standard and proprietary networking protocols emerge, begin to show promise, and occasionally open up new market spaces and fundamental opportunities for technical innovation....LISTED UNDER: Embedded Systems & Networking | Chipsets, Other
Freescale Semiconductor has introduced its MSC8155 digital signal processor (DSP), a higher performance and cost-optimized version of the company's flagship MSC8156 DSP based on the latest StarCore technology. The MSC8155 includes next-generation acceleration and interconnect technologies that boost overall chip performance and further enhance the capabilities of broadband wireless base station equipment.
EDINBURGH, U.K. and GREENSBORO, N.C., (GlobeNewswire via COMTEX News Network) -- SELEX Galileo, a Finmeccanica Company and a world leading defense electronics manufacturer, and RFMD, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announce the extension of their collaboration to develop high frequency GaAs MMIC solutions focused on SELEX Galileo's ne...LISTED UNDER: Chipsets, Other
SCOTTSDALE, Ariz. (BUSINESS WIRE) -- LTE is a truly evolutionary communications platform and will become the dominant 4G technology. However, LTE deployment will be gradual and protracted. Nevertheless, chipset manufacturers, such as Broadcom, Infineon and Qualcomm, have established LTE product development plans, according to market research firm In-Stat (http://www....LISTED UNDER: Chipsets, Other
RF Micro Devices, Inc. has added four new products to its portfolio of 3G transmit modules. The RF3230, RF3231, RF3232, and RF3171 are designed to accelerate the implementation of 3G entry-level feature phones supporting one-to-two bands of WCDMA and two-to-four bands of GSM/GPRS (also referred to as WGPRS)....LISTED UNDER: Boards & Modules | Chipsets, Other
Automated Test Solution Validates Performance of Both A-GLONASS and A-GPS Technologies in Mobile DevicesFebruary 8, 2010 7:30 am | Wireless Design & Development | Product Releases | Comments
Spirent Communications plc introduces a solution to test Assisted GLONASS (A-GLONASS) capability on UMTS mobile devices and chipsets. Supported on Spirent's 8100 UMTS Location Technology Solution (ULTS), the new A-GLONASS testing capability gives early adopters of A-GLONASS a competitive edge by enabling the delivery of better-performing devices and improved user experiences.LISTED UNDER: Services, Calibration / Test | Chipsets, Other
By Akshaya Trivedi, Altera Corporation Figure 1. SoC framework and infrastructure. Radio Access Networks (RANs) are undergoing an architecture change to an all-IP flat network to reduce network deployment costs as well as to offer rich mobile applications and services at a lower end-to-end latency.
Leveraging highly integrated RFIC designs and high dynamic range converters helps meet the challenges of next-generation base stations. By Phillip Halford and Ed Balboni, RF Group, Analog Devices, Inc. click to enlarge Figure 1.
By Manuel Uhm and Mark Quartermain, Xilinx The baseband processing function represents a key area of product differentiation for Telecommunications Equipment Manufacturers (TEMs). However, the advent of 3.9/4G systems poses a difficult challenge to TEMs, as they struggle to evolve traditional DSP-centric channel cards to meet a new set of technical and commercial challenges.
The current generation of monitors are portable heart rate sensors that have found their way into general purposes for activities such as exercise and sports. While these devices are useful for individual purposes, they do not facilitate use by a coach or manager. By Archana Yarlagadda, Cypress Semiconductor click to enlarge Figure 1.