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LTE Deployment and Timing Considerations

November 14, 2011 9:32 am | Wireless Design & Development | Product Releases | Comments

When considering the deployment and timing considerations for LTE and LTE Advanced and their inter-relation with existing 3G wireless technologies like HSPA & EV-DO, a well thought out migration strategy needs to be in place for deployment including spectrum considerations, plans to address capacity constraints/demands, implications with respect to handling new services including Voice/VoIP, QoE (Quality of Experience) issues as well as key business impacts.

LISTED UNDER: Chipsets, Other

Fujitsu Adds WiFi+Bluetooth Combo to Wireless Module Offering

November 4, 2011 10:40 am | Wireless Design & Development | Product Releases | Comments

Fujitsu Components America announced it has added a compact, 802.11b/g wireless LAN + Bluetooth version 2.1+EDR (Enhanced Data Rate) combination module. The fully integrated module minimizes piece parts while providing engineers with a cost-effective way to easily and quickly add both wireless technologies to new product designs without requiring special expertise.

LISTED UNDER: Chipsets, Other

The Tinker's Toolbox - Venkat Mattela of Redpine and Øyvind Strøm of Atmel on Wireless Embedded Systems

October 26, 2011 12:23 pm | Wireless Design & Development | Product Releases | Comments

Hosted by Alix Paultre, the Tinker's Toolbox is the Advantage Design Group's web-based interview show where we talk about the latest technology, components, and design issues for the electronic design engineering community.    Venkat Mattela Øyvind Strøm In today's podcast we talk to Venkat Mattela, CEO at Redpine Signals, and Øyvind Strøm, senior director of wireless marketing at Atmel abo...

LISTED UNDER: Embedded Systems & Networking | Chipsets, Other
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D2 Technologies Partners with Altair Semiconductor to Create Ultra-Low Power 4G VoLTE Communications Solution

October 24, 2011 12:14 pm | Wireless Design & Development | Product Releases | Comments

D2 Technologies announced that it has partnered with one of the world's leading suppliers of commercial semiconductor solutions for FDD/TDD LTE, Altair Semiconductor, to meet the demand for turnkey LTE solutions. D2’s mCUE, a converged 4G mobile communications client for Voice over LTE (VoLTE) and RCS video calling applications, has been successfully integrated with Altair’s FourGee-3100/6200 LTE chipset platform.

LISTED UNDER: Chipsets, Other

CompactPCI Serial Board Provides Flexible Configuration

October 17, 2011 11:25 am | Wireless Design & Development | Product Releases | Comments

MEN Micro now offers the G215, a universal CompactPCI Serial peripheral board that provides flexible serial communication via an individual mix of UART and fieldbus interfaces. Although equipped with five standard interfaces, the G215 features a configurable FPGA IP core that offers nearly unlimited interface options that enables several functionalities.

LISTED UNDER: Chipsets, Other

cPCI Serial Board with Freely Configurable FPGA IP Core Offers Flexible Configuration

October 7, 2011 11:22 am | Wireless Design & Development | Product Releases | Comments

MEN Micro Inc. offers the G215, a universal CompactPCI Serial peripheral board that provides flexible serial communication via an individual mix of UART and fieldbus interfaces. Although equipped with five standard interfaces, the board features a configurable FPGA IP core that offers nearly unlimited interface options that enables several functionalities, according to the company.

LISTED UNDER: Chipsets, Other

Radicom Research Introduces Low-Cost Bluetooth Modules For Short Distances

August 18, 2011 11:06 am | Wireless Design & Development | Product Releases | Comments

Radicom Research announced the launch of its new RB4000 and RB4000HM Bluetooth modules for short-range wireless data connectivity. Manufactured to fulfill OEM needs for embedded short-range communication in products, the low-cost modules act as RS232 cable replacement and offer an affordable, easy alternative for wireless point-to-point communication across distances up to 60 feet.

LISTED UNDER: Boards & Modules | Chipsets, Other | Memory, Flash

Type 6 COM Express Modules Feature 2nd-Gen Intel Core Processor & ECC RAM

August 16, 2011 8:22 am | Wireless Design & Development | Product Releases | Comments

American Portwell Technology released the PCOM-B217VG-VI-ECC embedded computer module to add Intel's second-generation quad-core and dual-core Intel Core i7/i5 processors to its Type 6 COM Express product portfolio. The Type 6 connector pin assignment is the successor to Type 2, adding the DisplayPort and high-speed USB 3.

LISTED UNDER: Boards & Modules | Chipsets, Other
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Small, Flexible Power Management ICs Integrate Two Bucks Regulators and Two LDOs

July 20, 2011 10:29 am | Wireless Design & Development | Product Releases | Comments

Analog Devices introduced its ADP5034 regulator/LDO, an integrated power management IC that combines two 3-MHz, high efficiency, 1.2-A step down regulators with two 300-mA LDO (low drop out) regulators in a small LFCSP (lead-frame chip-scale) package. The company also introduced the ADP5024 regulator/LDO, which is identical to the ADP5034 but features a single 300-mA LDO regulator.

LISTED UNDER: Power, Management | Chipsets, Other

Standards-compliant, Multi-gigabit Wireless Chipset Gives Enhanced Functionality to Wireless Devices

June 9, 2011 10:09 am | Wireless Design & Development | Product Releases | Comments

Qualcomm Atheros Inc., the networking and connectivity subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and Wilocity, a leading developer of 60 GHz multi-gigabit wireless chipsets for the mobile computing, consumer electronics and peripheral markets, today announced the AR9004TB, the industry’s first tri-band Wi-Fi chipset that integrates the multi-gigabit performance of in-room 60 GHz band with seamless handoff to 2.

LISTED UNDER: Chipsets, Other

Centec Networks Extends TransWarpâ„¢ Family of Ethernet Switching Chipsets

April 19, 2011 10:19 am | Wireless Design & Development | Product Releases | Comments

SUZHOU, China, /PRNewswire-Asia/ -- Centec Networks, a leading innovator of carrier-grade IP/Ethernet switching silicon and advanced ODM/OEM system solutions, today announced it is ready to extend its TransWarpâ„¢ family of advanced packet-processing chipsets to include two new switching processors, Manhattanâ„¢ (CTC6028) and Brooklynâ„¢ (CTC5048)....

LISTED UNDER: Chipsets, Other

Centec Networks Extends TransWarp™ Family of Ethernet Switching Chipsets

April 19, 2011 10:19 am | Wireless Design & Development | Product Releases | Comments

SUZHOU, China, /PRNewswire-Asia/ -- Centec Networks, a leading innovator of carrier-grade IP/Ethernet switching silicon and advanced ODM/OEM system solutions, today announced it is ready to extend its TransWarp™ family of advanced packet-processing chipsets to include two new switching processors, Manhattan™ (CTC6028) and Brooklyn™ (CTC5048)....

LISTED UNDER: Chipsets, Other

USB 3.0 Host Controllers with Industry-Leading Transfer Speed and Low Power Consumption

March 10, 2011 7:21 am | Wireless Design & Development | Product Releases | Comments

SANTA CLARA, Calif. -- (BUSINESS WIRE) -- Renesas Electronics Corporation today announced the availability of its two new SuperSpeed Universal Serial Bus (USB 3.0) xHCI host controllers (part numbers µPD720201 and µPD720202) for electronic devices such as PCs and digital TVs that feature faster, effective data transfer speeds and reduced power consumption in low-power mode....

LISTED UNDER: Power, Controllers | Chipsets, Other | Memory, Flash

Companies Collaborate to Expand Wireless Mesh Network Platform with Ultra-High Transmission Range Chipset

March 1, 2011 7:19 am | Wireless Design & Development | Product Releases | Comments

CAMARILLO, Calif. -- (BUSINESS WIRE) -- Semtech Corp. and Virtual Extension today announced the expansion of their wireless mesh network platform to include a new, ultra-high transmission range (Tx) power chipset that brings a new level of performance to a wide variety of smart environment applications....

LISTED UNDER: Chipsets, Other

Alpha Micro Components USA to launch the latest GPS modules from GlobalTop Technology

February 28, 2011 6:18 am | Wireless Design & Development | Product Releases | Comments

Alpha Micro Components announced that it will be launching the latest GPS modules from GlobalTop Technology on Stand 1979 at the International CTIA WIRELESS® Show (Orlando, FL (March 22-24, 2011). GlobalTop’s GPS modules are engineered with customizable software providing them with the flexibility to be the ideal solution for a range of aerospace applications, such as weather balloons and rockets, as well as asset management and tracking sy...

LISTED UNDER: Boards & Modules | Services, Calibration / Test | Chipsets, Other

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