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Aeroflex Launches Single-box Multi-RAT Tester for Multi-mode eHRPD/LTE Handsets

June 18, 2010 9:12 am | Wireless Design & Development | Product Releases | Comments

Aeroflex announces the launch of a new option for the 7100 LTE Digital Radio Test Set that supports CDMA-based data standards such as Evolution-Data Optimized (EV-DO) and evolved High Rate Packet Data (eHRPD) as well as LTE-eHRPD hand-over. As CDMA network operators migrate towards LTE, the devices used by their subscribers will need to operate with both the legacy EV-DO sectors of the network and those that have been upgraded to LTE, a...

LISTED UNDER: Services, Calibration / Test | Chipsets, Other
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Automotive Chipsets Deliver Video and Control Continuously Over a Single Wire Pair to Improve Driver Safety

June 16, 2010 9:50 am | Wireless Design & Development | Product Releases | Comments

National Semiconductor Corp. today unveiled its FPD-Link III family of automotive-grade serializer and deserializer (SerDes) chipsets featuring the industry’s first real-time, bidirectional control channel for driver-assist video cameras. The FPD-Link III chipsets improve driver safety and response time by delivering clock, data, and real-time I2C bidirectional control, continuously over a single differential pair....

LISTED UNDER: Automotive | Automotive | Chipsets, Other

180 nm Ultra CMOS Process

June 10, 2010 11:34 am | Product Releases | Comments

Peregrine Semiconductor Corporation has entered in an exclusive agreement with IBM for the development and manufacture of future generations of Peregrine’s patented UltraCMOS™ silicon-on-sapphire (SOS) process technology, the industry’s highest-performance radio frequency complementary metal-oxide semiconductor (RF CMOS) process.

Test Solution Addresses the Rapidly-Growing Demand for Validating Wi-Fi Positioning Performance of Mobile Devices

June 9, 2010 7:51 am | Wireless Design & Development | Product Releases | Comments

SUNNYVALE, Calif.--(BUSINESS WIRE)--The rapidly-growing demand for ubiquitous location-based applications is driving the use of Wi-Fi positioning, in addition to existing location technologies such as A-GPS and Cell ID, to provide subscribers with location information more quickly and in more places....

LISTED UNDER: Services, Calibration / Test | Chipsets, Other

Fairchild Semiconductor's USB Accessory Switch Receives 20th Annual EDN Innovation Award

May 22, 2010 10:08 am | Wireless Design & Development | Product Releases | Comments

Fairchild Semiconductor's USB accessory switch, the FSA800, was announced as a winner in the 20th annual EDN Innovation Awards in the category of Analog: Signal Path. Fairchild's FSA800 is a 3:1 USB accessory switch enabling USB, audio and UART data to share a common connector port. The FSA800 also has a charger detection function, microphone connection capability and provides superior audio signal integrity as well as overvoltage prote...

LISTED UNDER: Chipsets, Other

Single-Chip Solution Augments the Performance of Converged Bluetooth™/Wi-Fi™ Chipsets

May 14, 2010 10:01 am | Wireless Design & Development | Product Releases | Comments

SiGe Semiconductor’s SE2601T is a RF switch/LNA front-end IC (FEIC) designed to enhance the performance and functionality of converged Bluetooth™/Wi-Fi™ chipsets for embedded applications. The device addresses the increasing convergence of connectivity requirements such as Wi-Fi™ and Bluetooth™ for the new generations of smartphones, netbooks, personal media players and digital cameras....

LISTED UNDER: Chipsets, Other

Amimon Surpasses Half a Million Units in Chipset Sales and Orders

May 14, 2010 7:43 am | Wireless Design & Development | Product Releases | Comments

Santa Clara, Calif. – Amimon announced that it has surpassed half a million units in chipset sales and orders. The company has been experiencing very strong and rapidly growing demand for its wireless 1080p WHDI™ (Wireless Home Digital Interface)™ chipset.  With a very strong first quarter and multiple new WHDI products to be launched in the next few months, Amimon is on track to crossing the one million chipset sales milestone by Holiday S...

LISTED UNDER: Chipsets, Other

Bluetooth Low Energy – Not Just Another Radio Frequency Networking Protocol

April 8, 2010 1:19 pm | Wireless Design & Development | Product Releases | Comments

By Brian Blum, Texas Instruments Bluetooth Low Energy (BLE) is fast-becoming the hottest buzz-word in low-power wireless communications. Within five years, we have seen a variety of standard and proprietary networking protocols emerge, begin to show promise, and occasionally open up new market spaces and fundamental opportunities for technical innovation....

LISTED UNDER: Embedded Systems & Networking | Chipsets, Other

DSP Offers Next-Generation Acceleration

April 8, 2010 1:19 pm | Product Releases | Comments

Freescale Semiconductor has introduced its MSC8155 digital signal processor (DSP), a higher performance and cost-optimized version of the company's flagship MSC8156 DSP based on the latest StarCore technology. The MSC8155 includes next-generation acceleration and interconnect technologies that boost overall chip performance and further enhance the capabilities of broadband wireless base station equipment.

RF Micro Devices® and SELEX Galileo Collaborative Announcement

March 1, 2010 9:24 am | Wireless Design & Development | Product Releases | Comments

EDINBURGH, U.K. and GREENSBORO, N.C., (GlobeNewswire via COMTEX News Network) -- SELEX Galileo, a Finmeccanica Company and a world leading defense electronics manufacturer, and RFMD, Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announce the extension of their collaboration to develop high frequency GaAs MMIC solutions focused on SELEX Galileo's ne...

LISTED UNDER: Chipsets, Other

LTE Chipset Makers Position for Long Term Endeavor

March 1, 2010 9:23 am | Wireless Design & Development | Product Releases | Comments

SCOTTSDALE, Ariz. (BUSINESS WIRE) -- LTE is a truly evolutionary communications platform and will become the dominant 4G technology. However, LTE deployment will be gradual and protracted. Nevertheless, chipset manufacturers, such as Broadcom, Infineon and Qualcomm, have established LTE product development plans, according to market research firm In-Stat (http://www....

LISTED UNDER: Chipsets, Other

Family of Transmit Modules for 3G Entry Phones Expanded

March 1, 2010 7:38 am | Wireless Design & Development | Product Releases | Comments

RF Micro Devices, Inc. has added four new products to its portfolio of 3G transmit modules. The RF3230, RF3231, RF3232, and RF3171 are designed to accelerate the implementation of 3G entry-level feature phones supporting one-to-two bands of WCDMA and two-to-four bands of GSM/GPRS (also referred to as WGPRS)....

LISTED UNDER: Boards & Modules | Chipsets, Other

Automated Test Solution Validates Performance of Both A-GLONASS and A-GPS Technologies in Mobile Devices

February 8, 2010 7:30 am | Wireless Design & Development | Product Releases | Comments

Spirent Communications plc introduces a solution to test Assisted GLONASS (A-GLONASS) capability on UMTS mobile devices and chipsets. Supported on Spirent's 8100 UMTS Location Technology Solution (ULTS), the new A-GLONASS testing capability gives early adopters of A-GLONASS a competitive edge by enabling the delivery of better-performing devices and improved user experiences.

LISTED UNDER: Services, Calibration / Test | Chipsets, Other

Antennas Enable Simultaneous Wi-Fi and Bluetooth Operation in Netbooks

December 14, 2009 11:48 am | Wireless Design & Development | Product Releases | Comments

SkyCross has expanded personal connectivity and improved end-user satisfaction by enabling Wi-Fi and Bluetooth to operate simultaneously in netbooks. Because 802.11 b/g/n and Bluetooth operate at 2.4 GHz, interference between the two RF signals previously made using both functions at the same time nearly impossible, particularly when the two antennas were in close proximity inside a device.

LISTED UNDER: Chipsets, Other

Interoperability Testing will Highlight Growing Adoption of New 3GPP Femtocell Standard

October 12, 2009 9:07 am | Wireless Design & Development | Product Releases | Comments

CHELMSFORD, Mass., PRNewswire-FirstCall/ -- Airvana, Inc. announced the company's planned participation in the upcoming "1st Femto Forum UMTS Femtocell Plugfest" scheduled to take place in March 2010. Airvana will be showcasing interoperability of the company's HubBub™ UMTS femtocell with other vendors' products within the femtocell ecosystem....

LISTED UNDER: Services, Calibration / Test | Chipsets, Other

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