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SmartSwitch ANDSF Integration Extends Policy on the Device

February 24, 2013 11:41 am | by Roke Manor Research Ltd | Wireless Design & Development | Product Releases | Comments

Roke Manor Research Ltd (Roke), a Chemring Group company, has proven 3GPP ANDSF and OMA-DM compliance with its SmartSwitch subscriber engagement and connection management app. SmartSwitch provides a world-first capability in the measurement and management of user experience with a breakthrough combination of 3GPP network policy.

LISTED UNDER: IC | Test and Measurement, Other | Power, Battery

XP Power's JCA10 Series of DC-DC Converters

February 21, 2013 8:40 am | by WDD Staff | Product Releases | Comments

XP Power has announced the JCA10 series of single- and dual-output 10 W metal cased DC-DC converters. Already a popular DC-DC converter family, the JCA series now features availability in 2, 3, 4, 6, and 10 W models and  under-voltage lockout.

LISTED UNDER: Mixers, Frequency Converters | Mixers, Up / Down / Converters | Down and Up Converters

Components Corporation Reintroduces FJ Series

February 21, 2013 8:38 am | by WDD Staff | Product Releases | Comments

Components Corporation has reintroduced the FJ Series of printed circuit board Jumpers developed specifically for SMT applications in additional package sizes. The FJ-Series is a surface mount technology jumper, developed s for SMT applications.

LISTED UNDER: Boards & Modules | Development Kits / Platforms | Chipsets, Other
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RLC Electronics Expands STR-2 Series

February 14, 2013 9:45 am | by WDD Staff | Product Releases | Comments

RLC Electronics Inc. has announced the expansion of the Terminated Single Pole Double Throw switch (STR-2 series) with a new 50 GHz version using 2.4 mm connectors. This model is optimized for excellent RF performance and features VSWR 2:1 and an isolation of 50 dB.

LISTED UNDER: Boards & Modules | IC | Power, Other

Redpine Signals IntroducesWireless M2M Combo Chip

February 13, 2013 5:09 pm | by WDD Staff | Product Releases | Comments

Redpine Signals, Inc. has announced the release of its RS9113 M2MCombo chip, the first of its kind in the industry. It integrates dual-band 802.11n Wi-Fi, ZigBee, and dual-mode BT 4.0 wireless connectivity, making it the ideal device for universal M2M communications applications.

LISTED UNDER: Chipsets, Multifunction | Chipsets, Other | Digital Hardware, Other

Cicoil Silicone Cables Provide Consistent Reliability for Telepresence Robots

February 7, 2013 10:23 am | by WDD Staff | Product Releases | Comments

Designed for today’s demanding Mobile Video-Conference & Telepresence Robot applications, Cicoil's ultra-flexible flat silicone cables are halogen-free, flame retardant, and perform exceptionally well in confined area environments. In addition, Cicoil’s unique designs provide premium current carrying capacity.

LISTED UNDER: IC | Interconnect, Cables

Cost-effective UE910 V2 and Mid-range HE910 V2 Modules

January 8, 2013 4:34 am | Wireless Design & Development | Product Releases | Comments

Telit Wireless Solutions announced the introduction of the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets, each to be banded for European and North American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE support. The entry-level 3G UE910 V2 is based on Qualcomm Technologies’ QSC6270 chipset and delivers a top 3....

LISTED UNDER: Chipsets, Other | Software, Other

Enclosure Achieves 115 CFM of Airflow

November 26, 2012 5:18 am | Wireless Design & Development | Product Releases | Comments

Pixus Technologies has announced a new version of its SlimBox line of enclosures to address advanced cooling requirements. As new high speed (and high heat) chipsets are designed onto the latest CompactPCI, OpenVPX, and other boards; the requirement for additional enclosure cooling continues to grow.

LISTED UNDER: Chipsets, Other
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Complete Suite of Wireless Technology for System-on-Chip (SoC) Integration

November 1, 2012 7:10 am | Wireless Design & Development | Product Releases | Comments

Redpine Signals, Inc. announced its full suite of wireless technologies (Wi-Fi®, Bluetooth®, ZigBee® ) is now available for SoC integration. The portfolio includes 802.11abgn 1x1 through 802.11abgn/ac 3x3; BT 4.0 ad ZigBee, which will all be demonstrated at booth-10 at the ARM TechCon at the Santa Clara Convention Center on October 30.

LISTED UNDER: Semiconductors, SoC | Chipsets, Other

ICs Offer Wide Input Common-mode Voltage Range from 2V to 25V

October 24, 2012 6:37 am | Wireless Design & Development | Product Releases | Comments

Touchstone Semiconductor announced two new members of its  1?A current-sense amplifier portfolio – the unidirectional TS1102 and the bidirectional TS1103 . Starting at $0.61 each in 1,000-piece quantities, these new current-sense amplifiers combine a very low 1?A supply current, a 200-µV (max) V OS , and very low (0.

LISTED UNDER: IC | Amplifiers, Other

Wireless Device Precompliance Testing goes into the Lab with Automated Tests

June 12, 2012 11:10 am | Wireless Design & Development | Product Releases | Comments

In wireless device precompliance testing, the compact R&S DST200 RF diagnostic chamber from Rohde & Schwarz now automatically sets the equipment under test (EUT) to the required position. The new options make the R&S DST200 the only RF test chamber on the market that enables OTA performance and RSE testing of wireless devices such as smartphones right on the lab bench.

LISTED UNDER: Services, Calibration / Test | Chipsets, Other

Voltage Regulator ICs Tout Low Dropout Voltage

May 8, 2012 5:41 am | Product Releases | Comments

Based on CMOS technology, Seiko Instruments’ S-13A1 Series is a positive voltage regulator with a low dropout voltage, high output voltage accuracy and low current consumption. Developed with a 2.2-uF small ceramic capacitor, the regulator uses a load current protection circuit preventing the output current from exceeding the current capacitance of the output transistor and a thermal shutdown circuit preventing damage due to overheating.

LISTED UNDER: IC

RFID Reader ICs Fit Power, Size and Cost Constraints of Embedded and Consumer Applications

April 3, 2012 6:56 am | Wireless Design & Development | Product Releases | Comments

Two new RFID reader chips from austriamicrosystems combine low-power operation, small size and low cost to offer an attractive route to RFID implementation in embedded, portable and consumer devices. The AS3993 is an EPC Class 1 Gen 2 RFID reader IC which implements all the relevant protocols, including ISO 18000-6C, the ISO 29143 air-interface protocol for mobile RFID interrogators, and ISO 18000-6A/B (for operation in direct mode).

LISTED UNDER: Consumer | IC | Transmission, Other

IR Introduces 600V ICs for Energy Efficient Inverterized Motor Drive Applications

March 15, 2012 11:42 am | Product Releases | Comments

International Rectifier has introduced the compact IRS2334SPbF and IRS2334MPbF three-phase 600V ICs for inverterized motor drives used in energy efficient appliance and industrial applications. The IRS2334SPbF is offered in an SOIC20WB package while the IRS2334MPbF is available in a QFN5X5 package featuring a footprint of just 25mm 2 and designed with the appropriate creepage and clearance requirements to enable rugged and reliable designs at voltages up to 600V.

LISTED UNDER: IC

Aeroflex and 7Layers Collaborate on LTE Device Verification

February 23, 2012 4:25 am | Wireless Design & Development | Product Releases | Comments

Aeroflex and 7Layers, an international group of engineering & test centers, have joined forces to provide the LTE testing market with a cost-effective test system that assesses the interworking of LTE-capable terminals or chipsets with LTE networks and the Universal Integrated Circuit Card (UICC).

LISTED UNDER: Chipsets, Other

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