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Binder Expands Connector Series

March 18, 2013 10:58 am | by WDD Staff | Product Releases | Comments

Binder-USA has expanded its Series 768 and 718 M8 product line with new 8-pin panel-mount receptacles. The receptacles provide an ideal solution for applications requiring high pin numbers in areas with limited space. The connectors are commonly used for sensors and actuators...

LISTED UNDER: IC | Components, Other | Interconnect, Connectors
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Phihong's New Single-Output Midspan

March 13, 2013 10:26 am | by WDD Staff | Product Releases | Comments

Phihong USA has developed a new single-output midspan that can power IEEE802.3 at compliant applications up to 200 m (660 ft) from a network switch. The waterproof injector, designated the POE33S-1AT-N, also features a min average efficiency of 73%.

LISTED UNDER: Boards & Modules | IC

Littelfuse Introduces First Fuse Certified under UL913

March 8, 2013 10:35 am | by WDD Staff | Product Releases | Comments

Littelfuse, Inc. has introduced the PICO 259-UL913 Series Intrinsically Safe Fuse, the first and only Fuse to be certified under the latest revision of the UL913 Safety Standard for Intrinsically Safe Apparatus and Associated Apparatus for Use in Class I, II, and III, Division 1, Hazardous (Classified) Locations.

LISTED UNDER: IC | Telecommunications

HARTING Adds Cabled RJ45 cCupler to Har-Port Family

March 5, 2013 10:53 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

HARTING has expanded its har-port line of service interfaces with RJ45 couplers with patch cables already fitted. Users no longer need a separate socket or patch cables with their RJ45 coupler. These compact and robust, fully shielded interfaces.

LISTED UNDER: Boards & Modules | IC | Switches, IC

Imec & Panasonic Unveil Low-Power Chipset for 60GHz Multi-Gbit Wireless Communication

February 26, 2013 10:03 am | by WDD Staff | Wireless Design & Development | Product Releases | Comments

Imec, in collaboration with Panasonic Corporation, has presented at the IEEE International Solid-State Circuits Conference (ISSCC2013) a 60 GHz radio transceiver chipset with low power consumption that delivers high data rates over short distances.

LISTED UNDER: Chipsets, Other | Chipsets, RF | Transceivers, Other

CTS Heat Sinks with Low Thermal Resistance

February 26, 2013 10:02 am | by WDD Staff | Product Releases | Comments

CTS Electronic Components, Incorporated [NYSE: CTS] has announced a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. Features include applicability for BGA, PGA, PLCC, QFP, and other IC packages.

LISTED UNDER: IC

SmartSwitch ANDSF Integration Extends Policy on the Device

February 24, 2013 11:41 am | by Roke Manor Research Ltd | Wireless Design & Development | Product Releases | Comments

Roke Manor Research Ltd (Roke), a Chemring Group company, has proven 3GPP ANDSF and OMA-DM compliance with its SmartSwitch subscriber engagement and connection management app. SmartSwitch provides a world-first capability in the measurement and management of user experience with a breakthrough combination of 3GPP network policy.

LISTED UNDER: IC | Test and Measurement, Other | Power, Battery

XP Power's JCA10 Series of DC-DC Converters

February 21, 2013 8:40 am | by WDD Staff | Product Releases | Comments

XP Power has announced the JCA10 series of single- and dual-output 10 W metal cased DC-DC converters. Already a popular DC-DC converter family, the JCA series now features availability in 2, 3, 4, 6, and 10 W models and  under-voltage lockout.

LISTED UNDER: Mixers, Frequency Converters | Mixers, Up / Down / Converters | Down and Up Converters

Components Corporation Reintroduces FJ Series

February 21, 2013 8:38 am | by WDD Staff | Product Releases | Comments

Components Corporation has reintroduced the FJ Series of printed circuit board Jumpers developed specifically for SMT applications in additional package sizes. The FJ-Series is a surface mount technology jumper, developed s for SMT applications.

LISTED UNDER: Boards & Modules | Development Kits / Platforms | Chipsets, Other

RLC Electronics Expands STR-2 Series

February 14, 2013 9:45 am | by WDD Staff | Product Releases | Comments

RLC Electronics Inc. has announced the expansion of the Terminated Single Pole Double Throw switch (STR-2 series) with a new 50 GHz version using 2.4 mm connectors. This model is optimized for excellent RF performance and features VSWR 2:1 and an isolation of 50 dB.

LISTED UNDER: Boards & Modules | IC | Power, Other

Redpine Signals IntroducesWireless M2M Combo Chip

February 13, 2013 5:09 pm | by WDD Staff | Product Releases | Comments

Redpine Signals, Inc. has announced the release of its RS9113 M2MCombo chip, the first of its kind in the industry. It integrates dual-band 802.11n Wi-Fi, ZigBee, and dual-mode BT 4.0 wireless connectivity, making it the ideal device for universal M2M communications applications.

LISTED UNDER: Chipsets, Multifunction | Chipsets, Other | Digital Hardware, Other

Cicoil Silicone Cables Provide Consistent Reliability for Telepresence Robots

February 7, 2013 10:23 am | by WDD Staff | Product Releases | Comments

Designed for today’s demanding Mobile Video-Conference & Telepresence Robot applications, Cicoil's ultra-flexible flat silicone cables are halogen-free, flame retardant, and perform exceptionally well in confined area environments. In addition, Cicoil’s unique designs provide premium current carrying capacity.

LISTED UNDER: IC | Interconnect, Cables

Cost-effective UE910 V2 and Mid-range HE910 V2 Modules

January 8, 2013 4:34 am | Wireless Design & Development | Product Releases | Comments

Telit Wireless Solutions announced the introduction of the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on Qualcomm Technologies, Inc. chipsets, each to be banded for European and North American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE support. The entry-level 3G UE910 V2 is based on Qualcomm Technologies’ QSC6270 chipset and delivers a top 3....

LISTED UNDER: Chipsets, Other | Software, Other

Enclosure Achieves 115 CFM of Airflow

November 26, 2012 5:18 am | Wireless Design & Development | Product Releases | Comments

Pixus Technologies has announced a new version of its SlimBox line of enclosures to address advanced cooling requirements. As new high speed (and high heat) chipsets are designed onto the latest CompactPCI, OpenVPX, and other boards; the requirement for additional enclosure cooling continues to grow.

LISTED UNDER: Chipsets, Other

Complete Suite of Wireless Technology for System-on-Chip (SoC) Integration

November 1, 2012 7:10 am | Wireless Design & Development | Product Releases | Comments

Redpine Signals, Inc. announced its full suite of wireless technologies (Wi-Fi®, Bluetooth®, ZigBee® ) is now available for SoC integration. The portfolio includes 802.11abgn 1x1 through 802.11abgn/ac 3x3; BT 4.0 ad ZigBee, which will all be demonstrated at booth-10 at the ARM TechCon at the Santa Clara Convention Center on October 30.

LISTED UNDER: Semiconductors, SoC | Chipsets, Other

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