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Rohde & Schwarz Achieves LTE-A Cat6 Carrier Aggregation Full Stack Throughput

April 22, 2014 12:30 pm | by WDD Staff | Product Releases | Comments

In a joint effort, Rohde & Schwarz and Qualcomm Technologies have extensively tested the user plane throughput of the new Qualcomm® Gobi™ 9x35 chipset in compliance with 3GPP Release 10 for LTE-Advanced...

LISTED UNDER: Chipsets, RF | Test and Measurement, Signal Generators
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Step-Down Buck DC-DC Converter

January 8, 2014 5:01 pm | by WDD Staff | Product Releases | Comments

Advanced Power Electronics has introduced the APE1723-HF-3, a 200kHz 1A PWM buck DC-DC convertor with an adjustable output voltage range from 0.745 to 24 V. The APE1723-HF-3 can drive a 1A load without an external transistor, saving considerable board real estate...

LISTED UNDER: Mixers, Frequency Converters | Components, Other | Power, Converters

TDK Extends Portfolio of EPCOS 2220 SMT Inductors

January 7, 2014 5:03 pm | by WDD Staff | Product Releases | Comments

TDK has extended its portfolio of EPCOS SMT inductors in case size 2220 (IEA). The new SIMID 2220-T series covers inductance values in the range from 1.0 µH to 10,000 µH (E12 series)...

LISTED UNDER: IC | Components, Other | Passives, Inductors

Hittite’s New 24 dB Power Detector

January 7, 2014 4:55 pm | by WDD Staff | Product Releases | Comments

Hittite Microwave has announced a new E-Band MMIC power detector that is ideal for communications systems, test equipment, sensors and general purpose RF detection over the 71 to 86 GHz frequency range...

LISTED UNDER: IC | Circuits, SOC | Components, Other

DecaWave Launches Precise Indoor Location and Communication CMOS Chip

November 27, 2013 1:51 pm | by WDD Staff | Product Releases | Comments

DecaWave announced its first single chip of the ScenSor wireless technology family, DW1000, which makes indoor location and communications more accurate, cost-effective and power-efficient than ever before...    

LISTED UNDER: IC | Components, Other

Integrated Isolated Energy Measurement Chipset

October 29, 2013 4:12 pm | by WDD Staff | Product Releases | Comments

Maxim Integrated’s highly adaptable, isolated energy measurement solution reduces design cost, size, and complexity...

LISTED UNDER: Chipsets, Multifunction | Chipsets, Other

Thermally-Conductive Polymer from Carbodeon

October 29, 2013 11:29 am | by WDD Staff | Product Releases | Comments

Carbodeon has developed a thermal filler using nanodiamonds that increase the conductivity of thermally conductive polymers by 25 percent, providing significant performance increases for polymers used in electronics and LED manufacture...

LISTED UNDER: IC | Components, Other | Substrates

Infineon Ramps Production of Chipsets for Millimeter Wave Backhaul

October 15, 2013 5:08 pm | by WDD Staff | Product Releases | Comments

Infineon Technologies has started the production of its BGTx0 chipsets for wireless backhaul communication systems.

LISTED UNDER: Chipsets, IF | Chipsets, Multifunction | Chipsets, Other

Peregrine Introduces High Isolation Carrier-Grade Wi-Fi Switch

October 8, 2013 10:50 am | by WDD Staff | Product Releases | Comments

Peregrine Semiconductor has announced a very high performance carrier-grade WiFi switch. With the highest isolation by a factor of 50, Peregrine’s switch also offers great linearity, which makes it ideally suited for the fast-growing market of 802.11ac WiFi access points.

LISTED UNDER: Transmission, Other | Chipsets, RF | Transmitters, RF / Microwave

Gore's Right-Angle Connector for Spaceflight Applications

September 25, 2013 12:35 pm | by WDD Staff | Product Releases | Comments

The low-profile right-angle connector (ZQA) from W. L. Gore & Associates features a non-bifurcated swept contact design for use with low-loss microwave coaxial cable qualified for 32 GHz spaceflight applications.

LISTED UNDER: IC | Interconnect, Connectors

Vishay Intertechnology Enhances Series of Thin Film Chip Resistor Arrays

September 18, 2013 12:21 pm | by WDD Staff | Product Releases | Comments

Vishay Intertechnology has enhanced its ACAS 0612 precision thin film chip resistor arrays with tighter absolute TCR down to ± 10 ppm/K, relative TCR down to ± 5 ppm/K, and relative tolerance down to ± 0.05% for automotive, industrial, and telecommunications applications.

LISTED UNDER: Chipsets, Other | Passives, Fixed Resistors | Passives, Variable Resistors

Peregrine Enables New Approach to RF Switching in High-Power Wireless Systems

September 11, 2013 5:03 pm | by WDD Staff | Product Releases | Comments

Peregrine Semiconductor Corporation has announced the PE42820 and PE42821 single-pole double throw switches for high-power wireless applications. The new switches provide an unprecedented combination of high-power handling and excellent linearity.

LISTED UNDER: Antennas, Other | IC | Switches, IC

+36 dBm IIP3 Downconverting Mixer with Unprecedented 2.4dB Conversion Gain

September 9, 2013 5:51 pm | by WDD Staff | Product Releases | Comments

Linear Technology has announced the LTC5551, an ultrahigh dynamic range RF down-converting mixer for applications that demand the very best in performance. Unlike passive mixers which typically have 7 to 9 dB of conversion loss, the LTC5551 boasts 2.4 dB of conversion gain, substantially improving receiver dynamic range.

LISTED UNDER: Mixers, IC | Mixers, Up / Down / Converters

ams Introduces First LIN Slave Companion IC

August 26, 2013 3:28 pm | by WDD Staff | Product Releases | Comments

ams AG announced that the AS8530 is the world’s first miniature power/transceiver IC to support LIN slave applications, which complies with the ISO26262 functional safety standard.

LISTED UNDER: IC | Power, Ics

Cypress Releases New Components for PSoC Creator 2.2 IDE

July 15, 2013 3:16 pm | by WDD Staff | Product Releases | Comments

Cypress Semiconductor has released new components for PSoC Creator 2.2, the integrated design environment (IDE) for Cypress’s PSoC 3, PSoC 4 and PSoC 5LP programmable system-on-chip architectures. The Component Pack 6 update includes four new PSoC Components—pre-verified “virtual chips.”

LISTED UNDER: Chipsets, Other | Circuits, SOC

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