Wireless Design & Development

Embedded Systems & Networking

Tunable LTE Antenna Solution for M2M

May 22, 2013 11:33 am | by WDD Staff | Product Releases | Comments

Taoglas USA, Inc. has teamed up with Peregrine Semiconductor Corporation to bring a dynamically tunable LTE antenna solution to the M2M market. The solution contains an embedded surface-mount ceramic PIFA antenna from Taoglas—the Warrior PA.710.A—and Peregrine’s successful PE64102 DuNE Digitally Tunable Capacitor (DTC) on one evaluation board.

LISTED UNDER: Antennas, Cellular / Micro / Pico Cell | Antennas, Other | Embedded Systems & Networking
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Microsoft Touts Xbox One as All-In-1 Entertainment

May 22, 2013 10:17 am | by BARBARA ORTUTAY, Associated Press DERRIK J. LANG, Associated Press | News | Comments

The company unveiled the Xbox One, an entertainment console that wants to be the one system households will need for games, television, movies, sports and other entertainment. It will go on sale later this year, for an undisclosed price.

LISTED UNDER: Boards & Modules | Embedded Systems & Networking | Optoelectronics & Displays

The New Consoles from Microsoft, Nintendo and Sony

May 22, 2013 10:02 am | by BARBARA ORTUTAY, AP Technology Writer | News | Comments

Microsoft is the last of the three big video game console makers to unveil its latest gaming system. The unveiling comes nearly eight years after the Xbox 360 went on sale. It follows last fall's debut of Nintendo's Wii U and a preview in February of the upcoming PlayStation 4 from Sony.

LISTED UNDER: Boards & Modules | Embedded Systems & Networking | Optoelectronics & Displays

Why Google Glass?

May 20, 2013 5:35 pm | by TED Talk, Sergey Brin | Videos | Comments

It's not a demo, more of a philosophical argument: Why did Sergey Brin and his team at Google want to build an eye-mounted camera/computer, codenamed Glass? Onstage at TED2013, Brin calls for a new way of seeing our relationship with our mobile computers -- not hunched over a screen but meeting the world heads-up.

LISTED UNDER: Embedded Systems & Networking | Optoelectronics & Displays | Sensors & Transducers

HotSpot Episode 13: Samsung Announces 5G

May 20, 2013 10:38 am | by Eric Sorensen, Coordinator of Multimedia Development | Videos | Comments

  In this week’s episode of the HotSpot, brought to you by Memory Protection Devices, Samsung announces 5G mobile communications; a Japanese company announces an iPhone attachment that produces smell; a new wireless data transmission record is set; and o-synce puts the answer to the challenge of exercise motivation in front of your eyes.

LISTED UNDER: Boards & Modules | Electromechanical / Mechanical | Embedded Systems & Networking

Microchip's Arduino Compatible chipKIT Boards

May 17, 2013 10:52 am | by WDD Staff | Product Releases | Comments

Microchip Technology announced from the expansion of its Arduino compatible chipKIT platform ecosystem, with new tools from partners Digilent, the Fair Use Building and Research (FUBAR) Labs, and Schmalz Haus.

LISTED UNDER: Boards & Modules | Development Kits / Platforms | Embedded Systems & Networking

HotSeat Episode 1: IP Network Validation

May 17, 2013 10:26 am | by Alex Shanahan, Multimedia Production Specialist, WDD | Videos | Comments

In this episode, Joe Zeto, Director of Product Marketing for Ixia, discusses some of the major challenges in regards to network architecture design; prominent security issues associated with wireless networks; and trends he sees occurring within the industry.

LISTED UNDER: Boards & Modules | Electromechanical / Mechanical | Embedded Systems & Networking

Agilent Technologies Collaborating with Nallatech on High-Speed Signal and Monitoring Systems

May 16, 2013 6:16 pm | by Agilent Technologies Inc., Nallatech | News | Comments

Agilent Technologies Inc. [NYSE: A] has announced it is collaborating with Nallatech, a subsidiary of Interconnect Systems Inc, a leading provider of accelerated computing solutions, to develop high-speed signal acquisition and network monitoring systems that address the high-throughput processing and signal diversity requirements of LTE/SAE core and access optical networks.

LISTED UNDER: Boards & Modules | Electromechanical / Mechanical | Embedded Systems & Networking

Engineering Newswire 38: Lockheed Laser Shoots Down Drones

May 16, 2013 11:51 am | by Eric Sorensen, Coordinator of Multimedia Development | Videos | Comments

Today on Engineering Newswire, brought to you by Interpower, the premier supplier of power system components for worldwide markets, we’re kicking turtles to make new shapes, enhancing our senses, printing on the Afinia 3D printer, and shooting down drones, with lasers.

LISTED UNDER: Boards & Modules | Electromechanical / Mechanical | Embedded Systems & Networking

Avago Technologies’ New Dual-Channel, Bi-Directional Optocoupler

May 16, 2013 11:48 am | by WDD Staff | Product Releases | Comments

Avago Technologies [Nasdaq:AVGO] has announced a new dual-channel, bi-directional 25 MBd digital optocoupler device, the ACSL-7210. The device is a dual-channel, high-speed digital optocoupler, optimized for bi-directional industrial communication networks.

LISTED UNDER: Transmission, Couplers | Embedded Systems & Networking

New Triple-Play Platform Connects Raspberry Pi, Arduino and 32-bit Embedded ARM

May 14, 2013 4:41 pm | by Newark, element14 | News | Comments

One of a strong pipeline of exclusive Raspberry Pi accessories to be launched this year, Embedded Pi is available through Newark element14 and MCM in North America, Farnell element14 in Europe, CPC in the UK and Ireland and element14 in Asia Pacific.

LISTED UNDER: Boards & Modules | Embedded Systems & Networking

Far-Field Voice Input Processing

May 13, 2013 5:15 pm | by Meaghan Ziemba, Editor, WDD | Articles | Comments

Past attempts of providing this functionality have not been successful due to the difficulty with far-field voice input processing (FFVIP). When a microphone is close to the mouth of the individual talking, the quality of the audio tends to be better and louder than the surrounding noise.

LISTED UNDER: Embedded Systems & Networking | Sensors & Transducers

HotSpot Episode 12: 3D Microbatteries

May 13, 2013 10:47 am | by Eric Sorensen, Coordinator of Multimedia Development | Videos | Comments

This week on WDD’s HotSpot, Casetop from Livi Design is a netbook-like combo that uses a smartphone for its computing power; the University of Illinois at Urbana-Champaign has created new microbatteries, sought to achieve a more favorable balance between energy and density; and SM Instrument Company and the Korea Advanced Institute of Science and Technology have created a sound camera, the SeeSV-S205.

LISTED UNDER: Boards & Modules | Electromechanical / Mechanical | Embedded Systems & Networking

Engineering Newswire 37: Boeing Makes Hypersonic History

May 10, 2013 11:08 am | by Eric Sorensen, Coordinator of Multimedia Development | Videos | Comments

Today on Engineering Newswire, brought to you by Pivot Point, the leading designer and manufacturer of non-threaded fastener solutions, we're improving Artificial Intelligence with sensors, flying robotic bees, making hypersonic history, and getting ready to launch GOES-R.

LISTED UNDER: Boards & Modules | Electromechanical / Mechanical | Embedded Systems & Networking

Carnegie Mellon Robot Uses Arms, Location & More To Discover Objects

May 7, 2013 9:38 am | by Carnegie Mellon University | News | Comments

A robot can struggle to discover objects in its surroundings when it relies on computer vision alone. But by taking advantage of all of the information available to it — an object's location, size, shape and even whether it can be lifted — a robot can continually discover and refine its understanding of objects, say researchers at Carnegie Mellon University's Robotics Institute.

LISTED UNDER: Boards & Modules | Electromechanical / Mechanical | Embedded Systems & Networking

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