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Agilent Selected by Nitronex for High-Power GaN Design

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Agilent Technologies has announced that Nitronex has selected Agilent to provide a complete GaN design flow that spans both device modeling and circuit simulation. The flow uses Agilent EEsof EDA’s IC-CAP...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking | Semiconductors, Diodes

Ettus Research Releases SDR Platforms Featuring Kintex-7 FPGA

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Ettus Research, a National Instruments company, has introduced the USRP X300 and USRP X310 high-performance, modular software defined radio (SDR) platforms. Developers can programmatically control the USRP with the UHD C++ API, or choose from third-party tools and software...

LISTED UNDER: Development Kits / Platforms | Software, Design | Software, Development

Econais Launches the EC19W01

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Econais has announced the EC19W01, world’s smallest, smartest and most integrated 802.11b/g/n Wi-Fi System In Package (SiP) module.  The EC19W01 offers low power drain and features fully integrated MCU, Wi-Fi, cloud...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking
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Eurotech's Low Power Embedded Module

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Eurotech has announced the next generation of modules in the Catalyst series of embedded computers. The Catalyst BT Computer on Module (CoM), based on the Intel Atom E3800 series...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking

ACCES I/O Products Releases RS-232 Serial Adapter for Android Devices

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

ACCES I/O Products has released a new USB serial interface board—the ANDROID-232. Users can now control legacy RS-232 devices directly from modern Android devices. The ANDROID-232 uses the Android Open Accessory protocol to convince an Android device that its onboard USB port is an RS-232 port...

LISTED UNDER: Development Kits / Platforms | Components, Other | Power, Other

Advantech 1U Server Extends Carrier Grade Product Line

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Advantech has rolled out a new addition to its carrier-grade, NEBS-compliant server line in a flexible and compact 1U package with a depth of just 20”. The CGS-3000 is optimized for the needs of network equipment...

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking

RacoWireless, B&B Electronics Team Up to Offer Pre-Packaged Connectivity

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

B&B Electronics and RacoWireless have announced that they have teamed up to offer a Spectre cellular router with a prepaid wireless data plan. The B&B Electronics Spectre 3G cellular router, together with RacoWireless network services, provides everything customers need to connect, develop, deploy, and use M2M applications on the secure USA T-Mobile 3G cellular data network...

LISTED UNDER: Development Kits / Platforms

Agilent Technologies Introduces Real-Time Processing Capabilities for its PCIe Digitizers

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Agilent Technologies has introduced its next-generation real-time peak detection as one of the additional functionalities for its PCIe high-speed digitizers, starting with the U5303A 12 bit digitizer...

LISTED UNDER: Development Kits / Platforms | Digital Hardware, Signal Processing
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Vishay Intertechnology’s New Thin Film Chip Resistor Laboratory Sample Kits

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Vishay Intertechnology has announced that the company is now offering laboratory sample kits of its high-stability thin film chip resistors. The TNPW0402 e3 (LTW0402 e3 96/4) and TNPW0603 e3 (LTW0603 e3 96/4) kits...

LISTED UNDER: Development Kits / Platforms | Chipsets, Other

2 S-Band Power Amplifiers from TriQuint

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

RFMW has announced design and sales support for two S-band power amplifiers from TriQuint designed for Radar applications...

LISTED UNDER: Amplifiers, Power | Development Kits / Platforms

Nordson ASYMTEK’S Quantum System

May 2, 2014 8:42 am | by WDD Staff | Product Releases | Comments

Nordson ASYMTEK has introduced the Quantum Q-6800 high-performance, large-format dispensing system for SMT, PCB packaging, and microelectronics assembly applications...

LISTED UNDER: Development Kits / Platforms | Electromechanical / Mechanical | Embedded Systems & Networking

Ventev Wireless Infrastructure Releases New GE MDS Orbit Deployment Kit

May 2, 2014 7:59 am | by WDD Staff | Product Releases | Comments

Ventev Wireless Infrastructure, a division of TESSCO Technologies Incorporated, has announced the Ventev Deployment Kit for the GE MDS Orbit Platform...                   

LISTED UNDER: Development Kits / Platforms

Turnkey Demo Kit for High-Speed Connection to the World

April 25, 2014 11:04 am | by WDD Staff | Product Releases | Comments

Lantiq and Würth Elektronik eiSos have announced the availability of a jointly developed demonstration kit to provide an easy and fast way for implementing Ethernet in a broad range of products. The Evaluation Kit paves the way to easily add Ethernet hardware...            

LISTED UNDER: Boards & Modules | Development Kits / Platforms

TE Connectivity's Rugged, High-Voltage Solutions for Military Applications

April 21, 2014 10:48 am | by WDD Staff | Product Releases | Comments

TE Connectivity (TE) has announced its high-speed, high-reliability products for military marine applications...                                          

LISTED UNDER: Development Kits / Platforms | Interconnect, Cables

Sierra Wireless Introduces Legato

March 18, 2014 7:58 pm | by WDD Staff | Product Releases | Comments

Sierra Wireless has introduced the Legato platform, an open source embedded platform built on Linux and designed to simplify the development of machine-to-machine applications from the device to the cloud.

LISTED UNDER: Development Kits / Platforms | Embedded Systems & Networking

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