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"Does it Make Sense to Use Drop-In RF Modules in New RF Designs?

September 8, 2003 7:45 am | Product Releases | Comments

By Gael Coron, System Design-In Tools Manager Effort, low risk, low cost, low power, small factor form and level of re-use are the typical parameters on project managers hit lists when it comes to RF development. For wireless applications, project managers can find many RF modules on the market that can solve such issues....

LISTED UNDER: Boards & Modules

Power Entry Modules

September 2, 2003 8:42 am | Product Releases | Comments

Schurter introduces series DC11 and DC12 power entry modules. The unit combines an AC inlet, with optional EMC filter, and a rocker style switch recessed in the unit to prevent accidental actuation. The in-rush rating of the switch is 100 Amps for 3 to 4 milliseconds, 5 Amps continuous. Lifetime is rated for 50,000 cycles at 10 Amps/250 volts....

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Prototyping Boards

July 30, 2003 9:51 am | Product Releases | Comments

Traquair introduces a series of Virtex-II FPGA prototyping boards, providing a suitable platform for FPGA developers to evaluate, implement, test, and extend custom designs using high-density Xilinx Virtex-II FPGAs ranging from 1 MGates to 8 MGates. The prototyping boards are developed and produced by ErSt Electronic and allow FPGA developers to evaluate Virtex-II FPGA families in the FF1152 package....

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DC/DC Modules

July 8, 2003 11:09 am | Product Releases | Comments

Ericsson Power Modules announces the PKM-C family of DC/DC modules designed to respond to the high-current demand in distributed power architectures. The first module in the family, PKM4118GC PINB utilizes an enhanced footprint called 'Double-P' to improve thermal behavior. The module is suitable for a range of applications where the output current required on-board is in the range 50 A - 80 A....

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Laser Modules

July 8, 2003 11:09 am | Product Releases | Comments

California Eastern Labs announces a series of 10G 1550 nm Electro-Absorption MQW-DFB laser diode modules from NEC. Developed for use in DWDM systems and 10G transponders, NEC's NX8560MC Series modules combine laser, monolithically integrated EA modulator chip, and driver IC. Developed for ITU-T-based DWDM wavelengths, two models are available: the NX8560MC for 40 km and the NX8560MCS for 25 km....

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Circuit Protection Modules

May 30, 2003 11:46 am | Product Releases | Comments

Bel introduces SIP circuit protection modules. These integrated devices combine fuses, overvoltage protectors and resistor networks into a vertical mount, SIP configuration to conserve PCB real estate, optimize manufacturing throughput, and accelerate time-to-market. The modules feature Bel's 1....

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Connectable LED Modules

May 30, 2003 11:38 am | Product Releases | Comments

The StripLED connectable LED modules contain four super-bright, wide angle (85°C) SpiderLEDs, on 3-inch double-ended connector harness for daisy chain assembly, and a pre-applied strip of 3M® double-sided foam tape for "peel-and-stick" placement. LEDs are wired in parallel and function independently....

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Power Modules

May 30, 2003 11:38 am | Product Releases | Comments

TT electronics BI Technologies introduces a H-bridge IGBT power module that provides ultrafast diodes and space savings. The 7721 Series are offered in 500 volt/22 Amp or 600 volt/32 amp configurations. This module features internal temperature sensing for fast response to thermal overload. Standard configurations for the H-bridge module include the 7721-1A, featuring 22 A 500 V IGBT's with 8 A 600 V ultrafast diodes; and the 7721-2A, featu...

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Downconverter Modules

May 30, 2003 11:38 am | Product Releases | Comments

WJ Communications introduces a new line of surface mount downconverter modules for current and next generation mobile infrastructure base station applications. The CV210-1, CV210-3, and CV211-1 are high-linearity, dual and single-branch converters targeting specific wireless telecom bands. Functionality includes frequency conversion via integral LO driver amplifiers powering the passive mixer with the option of off-chip IF filtering....

LISTED UNDER: Boards & Modules

Direct Seal Modules

April 29, 2003 7:35 am | Product Releases | Comments

HF modules are manufactured for circuit designs at high frequencies where signal performance is critical. Utilizing a glass-to-metal sealing technique, modules maintain signal performance throughout all high frequency conductors without moding due to resistance. The modules are manufactured using Kovar housings....

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LCD Modules

March 28, 2003 9:42 am | Product Releases | Comments

The F-51553 series of 128 × 64 dot COG (chip-on-glass) monochrome STN transmissive LCD modules feature a 2.8 inches diagonal area that can display text and graphics together. The F-51553 modules provide a wide temperature range (– 20°C to +70°C). They also support serial as well as parallel interface....

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Power Amplifier Modules

March 28, 2003 3:52 am | Product Releases | Comments

Agilent's E-pHEMT power amplifier modules provide power added efficiency (PAE) for CDMA and GSM phones, and allow manufacturers to increase mobile phone batter life. The ACPM-7813 operates over the 824 MHz to 849 MHz frequency range, and features +28.5 dBm linear output power at 3.4 V. Supply voltages between 3....

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Coaxial Relay Modules

February 25, 2003 12:07 pm | Product Releases | Comments

0 The SMP6103 1 × 31 coaxial tree and SMP6301 (4) 1 × 4 self-terminated coaxial trees ensure that excellent crosstalk and isolation specifications are maintaining by using RF relays with bandwidths that exceed 2 GHz and low-loss coaxial interconnect cabling. The modules are configured to avoid unterminated stub effects, thus improving signal integrity and permitting larger high-frequency multiplexer configurations to be implemented...

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Bluetooth Modules

January 27, 2003 9:34 am | Product Releases | Comments

The LMX9820 is the first in a series that enables Bluetooth data connectivity via a UART serial port to support applications. The LMX9820 is part of the Simply Blue product family. All modules in this family include an embedded Bluetooth protocol stack, application-specific profiles, and a high-level command interpreter....

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Signal Modules

January 27, 2003 9:34 am | Product Releases | Comments

Model 5D70 is a single-input, dual-output, software-programmable conditioner for input of pressure, force, torque, weight, and other variables measured by DC-excited strain gage transducers. Self-contained in a hard aluminum case, the Model 5D70's analog design yields excellent signal stability and accuracy over a wide range of sensor inputs (configurable sensitivity ranges from 0....

LISTED UNDER: Boards & Modules

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