AVX Releases a Ruggedized Series of Ultra Low Profile Board-to-Board Compression Contacts
 AVX  (Greenville, SC) has released a new series of ruggedized, single piece, ultra low profile (ULP), board-to-board compression contacts. Providing full connector performance and functionality at the individual contact level, the innovative 70-9155 compression contacts feature a sweeping beam design that enables vertical or horizontal mating and high force, gold-plated beryllium copper contacts that maximize reliability and signal integrity, enabling lifetimes of up to 1,000 cycles.
Impervious to even extreme shock and vibration, the new 70-9155 ULP board-to-board compression contacts provide a rugged and reliable compression connection to the mating board and can be surface mounted to any position on a PCB, significantly enhancing design flexibility with regard to both layout and output voltage, which directly corresponds to the distance between contacts. The individual ULP contacts are also capable of reducing both the size and cost of end-designs in a broad range of harsh environment applications, including portable and handheld industrial devices, board-to-board power and signal connections, and ground connections between PCBs or housings.
Packaged on tape and reel for automated SMT placement, AVX’s new 70-9155 Series ULP board-to-board compression contacts are rated for 3A and -40° to +125°C. Currently comprised of two contacts, they feature:
- Nominal operating heights of 1.0 and 1.5mm.
- Operating height ranges of 0.75-1.25mm and 1.25-1.75mm.
- Design for high reliability performance up to 1,000 cycles.
- Beryllium copper contacts with nickel under plates, gold on the nose, and tin on the tails.
To satisfy the environmental and expected lifetime requirements of various end products, 70-9155 contacts are also available with three gold plating options: 0.1µm for 50 cycles (standard), 0.4 µm for 500 cycles, and 0.8 µm for 1,000 cycles.
For more information, please visit www.avx.com