Molex VITA 66.1 Optical MT Backplane Interconnect System
Molex Incorporated  (Lisle, IL) has launched the VITA 66.1 ruggedized optical MT backplane interconnect solution for high-density military, aerospace, and commercial embedded system applications. Features include:
- Availability with 8, 12, or 24 fibers in standard singlemode or multimode and VersaBeam (expanded beam) MT ferrule options for design flexibility.
- A robust aluminum housing.
- An operating temperature range from -50° to +105°C.
- ANSI-ratified 66.1 compliance.
For more information visit www.molex.com .