Complex PC Board Assemblies Provide Solutions
Complex PC board assemblies from Endicott Interconnect Technologies, Inc. (EI) are providing solutions for customers who face special challenges as they stretch the boundaries of traditional PCB performance. EI is developing new materials, processes and interconnect strategies that help to advance technologies and provide solutions for customer requirements in defense, aerospace, medical, computing/IT infrastructure and advanced test equipment applications. The company provides a wide range of assembly capabilities, including high density, double sided, hybrid PC board assemblies (SMT/PTH/press fit) with high component counts, high-I/O area array modules (CGA, LGA, PBGA), and dense, high-I/O connectors for very complex, compute-intensive applications. And, once the assembly is complete, EI designs and executes strategies for a wide range of analog, digital, power supply and JTAG testing.