Epoxy Adhesive Cures Rapidly at Room Temperature
Master Bond, Inc. introduces its EP41SMED high performance, low viscosity epoxy adhesive for fast room temperature curing and bonding applications. This compound has a 5:1 mix ratio by weight, and it has “handling” time from 10 to 15 minutes at ambient temperatures. Bonds are resistant to water, oil and many organic solvents, as well as cold sterilants, ETO and gamma radiation. It fully meets USP Class VI requirements, and it conforms to Title 21, US Code of Federal Regulations, FDA Chapter 1, Section 175.105 and 175.300 for food applications. Bonds are rigid, and they offer optimal adhesion to a variety of similar and dissimilar substrates including metals, glass, ceramics, rubbers, wood and most plastics.