Socket Adapter Systems
BGA Socket Adapter Systems from Advanced Interconnections Corp. solve reflow temperature mismatch issues when using lead-free devices on existing boards with standard solder profiles. When device packages are transitioned to lead-free, OEMs with RoHS Exempt products must change board soldering profiles and re-qualify existing components just to accommodate the higher processing temperatures required for proper lead-free device attach. Using the Advanced BGA Socket Adapter System, lead-free device packages are soldered to RoHS compliant adapters in a high temperature reflow profile. The boards are processed with standard sockets, featuring tin/lead solder ball terminals, without changing the board soldering profile. The device/adapter assembly is easily plugged into the board-mounted socket after board processing.