Lead-free Wafer Bumping Services
IC Interconnect announces its lead-free bumping capabilities are available now as a standard service offering. Reducing harmful substances in the environment, especially at the manufacturing source, has become increasingly important over the last decade. Current RoHS (Restrictions on Hazardous Substances) initiatives mandate that by July 1, 2006, all new electrical and electronic equipment put on the market in European Union member states shall not contain lead, mercury, cadmium or hexavalent chromium. IC Interconnect recognizes these global changes, and now offers bumping services with lead-free solder. IC Interconnect has been using electroless nickel as the UBM (under bump metallurgy) of choice since 1998. In 2001, this same UBM system was used in the development and qualification of the lead-free alloys available today. These lead-free alternatives fit into the existing assembly infrastructure, meet cost targets and are equal to or surpass current reliability requirements.