Tra-Bond 816H02 from Tra-Con is a thixotropic (smooth paste) heat conductive epoxy system. It is used for stacking transistors, diodes, resistors, integrated circuits, and other heat-sensitive components to printed circuit boards. This two-part adhesive develops high-impact bonds at room temperature and create electrically insulating contacts. The productbonds to itself, and to metals, silica, steatite, alumina, sapphire and other ceramics, glass, plastics, and other materials. Fully cured, the epoxy provides resistance to salt solutions, mild acids, and alkalis, and other chemicals including petroleum solvents, lubricating oils, and alcohol.