Thick Film Technology
TT electronics IRC has expanded its offering of thick-film technology, providing design engineers with a variety of flexible and reliable choices. A variety of materials are available for use within each of four systems based on the substrate: the Organic Materials system, Ceramic Air-fired system, Ceramic nitrogen-fired system and the Anotherm (printed circuit direct to heat sink) Aluminum system. The sheet resistance, TCRs and dielectric strength cover a wide range enabling designers to specify values to meet their design needs.
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