The MICROLAM® 600 Series Microvia Dielectric products have optimized electrical and mechanical properties. The materials are toughened to ensure superior reliability in cell phones, PDA's and other portable devices. MICROLAM 610 dielectric, a drop-in replacement for resin coated copper, minimizes dielectric cracking and provides improved PCB mechanical reliability. This reinforced microvia material consists of FR-4 epoxy resin and a continuous toughening matrix. MICROLAM 620 dielectric is a toughened, low dielectric constant material for chip package substrates. MICROLAM 630 consists of BT resin in a continuous toughening matrix, and is a low loss microvia material.