Taiyo Yuden has geared up its manufacturing facilities to begin mass production of the certified module this June, and plans to produce one million Bluetooth modules per month by the end of 2001. The new module, which enables wireless short-haul mobile communications in the 2.4GHz radio band, measures 32mm × 16mm × 2.4mm, includes maximum output to 4 dBm and is designed for use in a variety of mobile applications, among them cellular phones and personal digital assistants. Among its new and improved features is the ability to communicate seamlessly within a Bluetooth piconet, the wireless network of up to eight Bluetooth-enabled devices, and within a Bluetooth scatternet, which consists of multiple piconets.
Taiyo Yuden's certified module is built on the radio modem IC developed by Silicon Wave, Inc., a San Diego-based high-frequency semiconductor research and development company. The single-chip radio modem utilizes Silicon-on-Insulator (SOI) BiCMOS process technology and direct conversion demodulation, resulting in high-isolation, low switching loss, use of fewer subcomponents, e.g., SAW filters or LC filters, and thus lower cost and smaller size.