PLAYA VISTA, Calif. -- (Business Wire) -- Belkin International, Inc., has been honored with the CES (News - Alert) Innovations 2011 Design and Engineering "Best of Innovations" Award in the Portable Multimedia Accessories product category for its Grip 360° + Stand, an all-in-one iPad accessory that transforms three ways: a carrying case, a handheld case, and a stand.
IRVINE, Calif., /PRNewswire/ -- VIZIO, America's HDTV and Consumer Electronics Company, announced today that sales for the week ending November 7, 2010 reveal customers are looking for both innovative performance and value as the keys for shopping this holiday season. In a tough economy, consumers are researching and educating themselves more than ever before making purchases.
The Motorola Solutions business of Motorola, Inc. recently demonstrated live over-the-air (OTA) broadband video in the 700 MHz Public Safety spectrum band to the world’s first public safety data device using a commercial LTE chipset module. Motorola also congratulates BayWEB for their first live, OTA data session in the San Francisco Bay Area.
NEW YORK, /PRNewswire/ -- Hammacher Schlemmer (http://www.hammacher.com/?tid=pr78951), America's longest running catalog offering the unexpected for 162 years, has introduced The Magic Wand Remote Control ( www.hammacher.com/Product/78951 ), a device that adds a wizardly flourish to home entertainment, and a fun holiday gift.
By Jordan Robertson, AP Technology Writer SAN FRANCISCO (AP) -- A gloomy outlook from Cisco Systems Inc. is shaking some investors' faith in the strength of the technology industry's recovery. Corporations have loosened their purse strings after slashing their budgets. Some governments have poured money into stimulus-fueled technology projects.
Protect Power Components from Damage Caused by Thermal Events in Automotive and Industrial Applications.November 11, 2010 5:43 am | Comments
Tyco Electronics introduces a breakthrough technology that allows manufacturers to include surface-mountable thermal protection in their standard RoHS-compliant reflow assembly process. Manufacturers can realize significant savings by moving from hand assembly to cost-efficient surface-mount device (SMD) processes.
LOS ANGELES -- (BUSINESS WIRE)-- Soundfreaq announced the launch of Sound Platform, the company's first product: a wireless, hi-fi speaker, developed with LA-based design firm, Boombang. Launching just in time for the holidays, the Bluetooth-enabled device is equipped out-of-the box to support multiple devices, making it the perfect accessory for the iPad, iPhone, iPod touch, Android and Blackberry.
RFMD's High-Efficiency Power Transistor Delivers Superior Performance Versus GaAs and Silicon TechnologiesNovember 11, 2010 5:43 am | Comments
GREENSBORO, N.C., (GLOBE NEWSWIRE) -- RF Micro Devices, Inc. recently announced that RFMD® has released into production the RF3932, a 75W, highly efficient gallium nitride (GaN) RF unmatched power transistor (UPT) that delivers superior performance versus competing GaAs and silicon power technologies.
Nextreme Thermal Solutions introduces the eTEC™ HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C, the eTEC HV56 can pump 6W or 58 W/cm² of heat in footprint of only 11 mm².
Thermal Management Solutions Enhance Performance and Service Life of LEDs and LED Lighting AssembliesNovember 11, 2010 5:43 am | Comments
ALBANY, N.Y. -- (BUSINESS WIRE)--To help increase the performance and service life of LEDs (light emitting diodes) and LED assemblies, Momentive Performance Materials has introduced a new line of thermally conductive silicones to be considered for use in LED manufacturing and assembly. Available as the TIA series of curable thermal gels and adhesives and TIS series of curable thermal compounds, the new products may help LED lighting manufacturers solve the ongoing challenges of heat transfer and dissipation in LED lighting assemblies.
ADA Technologies Awarded $100K Contract to Develop Improved Thermal Interface Materials for Use in MicrochipsNovember 11, 2010 5:43 am | Comments
DENVER -- (BUSINESS WIRE) -- ADA Technologies, Inc. received a $100,000 contract from the U.S. Air Force for Phase I research into the development of improved thermal interface materials (TIM) for use in microchips. Thermal management is a limiting factor in further reduction of microchip size, as well as in the design of more complicated circuits for a variety of applications, including solid state tactical lasers, non-lethal denial technologies, and power metal-oxide semiconductor field-effect transistors (MOSFETs).
Compact LED Driver ICs Enable Significant Energy and Cost Savings in Vehicle Headlights and Tail LightsNovember 10, 2010 6:33 am | Comments
Munich, Germany, (Electronica 2010) NXP Semiconductors N.V. announced the availability of fully integrated, highly flexible driver IC solutions designed for vehicle LED headlights and tail lights, based on automotive-qualified technology. The ASL1010NTK and ASL1010PHN are the industry’s first automotive LED driver ICs to integrate critical functionality such as direct LED temperature feedback, LED fault detection, internal PWM control for dimming, and short circuit protection – all on an automotive-qualified analog mixed-signal platform in an 8/16-pin package.
DUISBURG, Germany --(BUSINESS WIRE) -- mimoOn announced availability of mimoOn’s LTE PHY and stack software for macro and small cell basestations for Texas Instruments Incorporated (TI) new C66x digital signal processors (DSPs). mimoOn’s Layer 1 SW has been integrated onto TI’s C66x-based, flexible, scaleable processor targeting LTE wireless infrastructure.
Freescale Semiconductor is now providing samples of 77 GHz silicon germanium (SiGe) integrated chipsets to select customers for use in automotive radar systems. Freescale’s radar solutions provide long- and mid-range functionality, allowing automotive systems to monitor the environment around the vehicle to help prevent crashes.
ZMDI Signs Cooperation Agreement with Fairchild Semiconductor on Point-of-Load Smart Power-Management TechnologyNovember 10, 2010 6:33 am | Comments
DRESDEN, GERMANY, (Electronics 2010) -- ZMD AG announced its strategic cooperation with Fairchild Semiconductor to develop energy-efficient power-management solutions for a range of point-of-load (POL) applications. According to the agreement, ZMDI’s advanced digital point-of-load technology, in conjunction with Fairchild’s XSTM DrMOS technology, will provide highly energy-efficient power-management solutions for applications such as base stations, telecommunications switches, network routers, servers, storage and industrial personal computers (PCs).