A Comprehensive Guide of CTS’ Heat Sinks
Indiana -- CTS Electronics Components [NYSE: CTS] and Avnet Electronics Marketing (NYSE: AVT), have announced the release of a comprehensive thermal solutions guide for Xilinx All Programmable FPGAs, 3D ICs and SoCs. The guide is a tool that enables thermal design experts to quickly identify heat sink solutions for their Xilinx All Programmable design.
Many common electronic devices rely on heat sinks to dissipate heat. Most people find them simple to use, easy to understand and cost effective. Mounted correctly, they may function virtually failure-free. As a leading designer and manufacturer of electronic components, CTS offers heat sinks with excellent thermal resistance to effectively dissipate heat in Xilinx All Programmable FPGAs, 3D ICs and SoCs. Due to the variety of packages and IC thicknesses of Xilinx’s packages, CTS provides three clip options (small, medium and large), multiple thermal interface materials and appropriate variations in the heat sinks’ base thickness to deliver the perfect thermal solution.
Additionally, CTS’ various mounting options require no special tools or additional holes on the PCB which allow for easy assembly and cost efficiency. “The development of the design guide for Xilinx All Programmable is a collaborative effort between CTS and Avnet,” states Terry Luxmore, director of thermal products for CTS. “The guide highlights our products’ superior performance which extends beyond most thermal solutions.”
“As CTS’ channel partner, Avnet recommends CTS’ heat sinks to designers who currently require or are considering thermal solutions that provide adequate device cooling,” says Matt Burns, global IP&E technical marketing specialist at Avnet Electronics Marketing. “CTS is an expert in its industry and its thermal management performance is second to none.”