Vishay Intertechnology to Showcase MLCCs and Surface-Mount and Wire-Bondable Thin Film Products at IMS 2013
Malvern, PA — Vishay Intertechnology, Inc. [NYSE: VSH] has announced that it will be showcasing the company's latest industry-leading multi-layer ceramic chip capacitors (MLCCs) and surface-mount and wire-bondable thin film products at the 2013 IEEE MTT International Microwave Symposium (IMS), being held from June 2-7 at the Washington State Convention Center in Seattle.
In booth #2303, Vishay Vitramon will introduce a new line of quad high-frequency, high-power MLCCs in 0505 and 1111 cases with high Q > 2000, ultra-low ESR, and voltage ratings from 25 VDC to 1500 VDC.
The devices are optimized for a wide range of high-frequency applications, including MRI coils and generators, RF instrumentation, and impedance matching networks. In addition, Vishay Vitramon will highlight its surface-mount, high-frequency MLCCs in the 0402, 0603, and 0805 case sizes, which are ideal for commercial applications such as VoIP networks; cellular base stations; and satellite, WiFi (802.11), and WiMAX (802.16) wireless communication.
At IMS 2013, Vishay Dale will be showcasing its high-frequency thin film chip resistors for low-noise amplifiers and line termination. Vishay Electro-Films (EFI) will be demonstrating surface-mount thin film RF capacitors for lumped element filters and impedance matching circuits, as well as wire-bondable thin film RF spiral inductors for RF tuning circuits and RF choking for DC biasing. In addition, Vishay EFI's RF filters and substrates will be on display. They offer a wide selection of materials and packaging capabilities and are qualified up to 70 GHz.