Packaging Challenges for Power Electronics in Electric Drive Vehicles
The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2012 titled “High Temperature, High Density Power Electronics for Electric Drive Vehicles” on Wednesday afternoon, February 8, 2012 at Coronado Springs Hotel in Disneyworld, Orlando, Florida. Featured are six invited experts from industry and one from a government research laboratory who will discuss the cost and performance targets set by the Department of Energy (DoE) for automotive power electronics through higher temperature operation and higher density packaging, and on applications of electric drive technology to industrial and military vehicles.
Ernie Parker from Crane Aerospace & Electronics and co-chair of the PSMA Packaging Committee stated, “The increasing content of power electronics not only on automobiles, but also on aircraft and industrial vehicles, represent a large growing market for our industry. This Industry Session provides an opportunity for attendees to interact with other professionals who are active in this area and to learn about innovative packaging technologies key to successfully penetrating this market.”
PSMA Packaging Committee members Ralph Taylor, Delphi, and Yunqi Zheng, GM Advanced Technology Center, are co-chairs for this session. PSMA encourages people to register for APEC 2012 and make plans to attend this industry session and to consider participating in the other PSMA-sponsored meetings during the week.
PSMA is a non-profit professional organization with the objective of enhancing the stature and reputation of its members and their products, and improvement of their technological power sources knowledge. Its aim is to educate the electronics industry, academia, government and industry communities as to the applications and importance of all types of power sources and conversion devices.
Posted by Janine E. Mooney, Editor
December 18, 2011