Solutions for Semiconductor Tool Qualification at ISMI Manufacturing Week

Thu, 10/06/2011 - 8:25am
CyberOptics Semiconductor will discuss how a “Wireless Particle Counting Wafer Improves Semiconductor Tool Qualification” during ISMI Manufacturing Week 2011 to be held in Austin, TX during October 17 - 21. On October 20th, during technical session 8, Allyn Jackson, CyberOptics Technical Support Manager, will explain how the WaferSense® Airborne Particle Sensor offers faster, more accurate qualification of process tools than traditional particle measurement methods such as monitor wafers and bench-top counters. Real-life scenarios of how advanced wafer processing companies have successfully counted particles down to 100nm in real-time using the Airborne Particle Sensor will be discussed.

CyberOptics Semiconductor introduced the WaferSense Airborne Particle Sensors (APS) early this year. The only semiconductor sensor of its kind to identify particle sources in tool, the APS moves through semiconductor process equipment and automation material handing systems to monitor airborne particles, reporting information in real-time to allow engineers to efficiently validate wafer contamination. With a wafer-like shape compatible with existing automation and wireless communication providing real-time data, the Airborne Particle Sensor speeds tool qualification and release to production. APS reduces time locating particle sources.

For more information on the Airborne Particle Sensor, please refer to our web site at

For more information on the event, refer to ISMI Manufacturing Week at

Posted by Janine E. Mooney, Associate Editor

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