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Thin-Film Thermoelectric Cooler Designed for High Heat Electronic Applications

Thu, 11/11/2010 - 5:43am
Nextreme Thermal Solutions introduces the eTEC™ HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements.

At 85°C, the eTEC HV56 can pump 6W or 58 W/cm² of heat in footprint of only 11 mm². The device measures 0.6 mm high, making it the thinnest, highest heat pumping TEC on the market today.

At 85°C, the eTEC HV56 can create a temperature differential (DeltaT) of up to 60°C between its hot and cold sides, and operates at a maximum voltage of 10.8V, making it compatible with commonly found board-level currents and voltages. At 25°C, the device can create a DeltaT of up to 50°C with a maximum voltage of 8.8V.

The eTEC HV56 is RoHS-compliant and is manufactured using gold-tin (AuSn) solder, which enables assembly temperatures as high as 320°C. These assembly temperatures make the HV56 compatible with industry standard processes for packaging electronic devices that require tight tolerances.

"Many of our customers have been asking for a higher wattage device in a single package," said Dave Koester, vice president of engineering at Nextreme. "The eTEC HV56 has four times the heat pumping capacity of our HV14 module and operates at higher voltages, making it easier to drive. The introduction of the HV56 also demonstrates our ability to scale up our technology in a variety of configurations based on customer requirements."

Nextreme engineers are currently working with customers in a variety of industries and applications. These include laser diode cooling, high-speed thermal test heads, and CPU hot spot cooling.

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