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Trident to Demonstrate the Industry's First Integrated 2D-to-3D Conversion at IFA Show

Wed, 09/01/2010 - 8:08am
SUNNYVALE, Calif., /PRNewswire/ -- At the IFA show this week in Berlin, Trident Microsystems, Inc. will be demonstrating the industry's first integrated 2D-to-3D conversion chipset that provides best-in-class 3D capabilities while also enabling a 3D TV to display the high volume of 2D content that exists today.

While most 3D TV manufacturers have been required to incorporate expensive ICs to handle the 2D-to-3D conversion, Trident has integrated this feature onto its PNX5130 chipset to reduce customers' 3D TV system cost, provide full flexibility for handling frame sequential and line interleaved 3D panels, and deliver the best picture quality through its halo-free MEMC and accurate 3D motion technology.

"By integrating the 2D-to-3D conversion feature directly onto our PN5130 chipset, Trident enables customers to deliver lower-cost 3D TVs that are capable of displaying the large volumes of 2D content in impressive 3D," said Dirk Wieberneit, senior vice president and general manager of the Trident TV Business unit. "Given that the majority of today's TV content is in 2D, this is a critical feature for the top TV OEMs and we are proud to be the first chip manufacturer to provide this capability in PNX5130 frame rate converter products."

PNX5130 is a video post processor that applies Motion Accurate Picture Processing (MAPP) to TV signals. PNX5130 generates 120 Hz and 240 Hz display output with full MEMC. In addition, 3D TV support and local dimming are available as options. The chip's 2D-to-3D conversion is a new feature that has been added to the PNX5130 to extend 3D TV support on line interleaved and frame sequential displays. The 2D to 3D conversion is content aware so that it will adapt to the specifics in the sequence to deliver optimal results.

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