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Laser Link Processing System Ships for DRAM Market Apps

Fri, 07/30/2010 - 8:34am
PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries (NASDAQ:ESIO), a leading supplier of innovative laser-based manufacturing solutions for the microtechnology industry, today announced shipment of its new 9850TPIR+ laser link processing system for the DRAM market. Built on ESI’s dual-beam 9850 platform, the 9850TPIR+ (Tailored Pulse Infra-Red Plus) extends the capability of its proprietary tailored pulse laser architecture to meet the growing productivity demands of DRAM manufacturers ramping 40 nanometer (nm) processes.

“Our customers are under enormous pressure to reduce costs while increasing yields. With the new 9850TPIR+ system, we are improving our market-leading architecture and introducing a new, higher performance fiber-based tailored pulse laser to deliver the market-leading throughput and productivity our customers demand to stay competitive,” said Louis Vintro, vice president and general manager of ESI’s Semiconductor Products Division.

Improving productivity in 40 nm DRAM manufacturing
ESI’s Model 9850TPIR+ laser link processing system is designed to meet the growing production and materials processing needs of a variety of DRAM and embedded memory devices, as well as deliver the industry’s lowest cost of ownership. The system features advances to ESI’s proprietary tailored pulse laser technology that includes higher resolution temporal pulse-profiling, coupled with higher repetition rate, to support new, challenging fuse designs. The robust 9850TPIR+ allows faster fuse blowing to deliver up to 20 percent improved productivity over ESI’s 9850TP while exceeding the accuracy and precision requirements for 40 nm DRAM.

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