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3G Americas Elects Qualcomm to Board of Governors

Wed, 06/23/2010 - 11:11am
3G Americas, a wireless industry trade association representing the GSM family of technologies and LTE, today announced the election of Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies, products and services, to its Board of Governors. Qualcomm joins the board – currently comprised of 16 leading operators and manufacturers – to work together to promote, facilitate and advocate for the deployment and adoption of the 3GPP family of technologies throughout the Americas.

  Neville Ray, Chairperson of 3G Americas’ Board of Governors and Senior Vice President of Engineering and Operations at T-Mobile USA, emphasized the impact of 3G Americas’ influence in the Americas and the importance of Qualcomm becoming one of its board members.

“We are excited to have Qualcomm join the 3G Americas Board of Governors. Their strength and leadership in the development of advanced wireless technology will notably enhance the work of the 3G Americas organization in advancing the deployment of mobile broadband networks based on the 3GPP family of technologies throughout the Americas region.”

  Chris Pearson, President of 3G Americas added, “Qualcomm’s market success coupled with its expertise in 3GPP technologies including HSPA and LTE will fill an essential role in adding to the ecosystem of companies currently serving our board. With the support of Qualcomm, an inventive leader in wireless, 3G Americas will continue to foster tremendous wireless technology advances throughout North, Central and South America.”

  HSPA is the leading mobile broadband technology worldwide and offers operators the ability to meet the increasingly advanced wireless needs of customers while maximizing their existing network assets. There are currently 322 commercial HSPA deployments in 137 countries worldwide with 62 HSPA commercial networks in 26 countries in the Western Hemisphere.

 
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