Wireless Design & Development

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All Items for Memory, SRAM

Devices with RadStop™ Technology Can Withstand 300 KRads; Deliver Throughput of up to 36 Gbps
Cypress Semiconductor, December-10
Affordable SMSC 4 Series Supports Massive SMS Volume
Wireless Design & Development Advantage Business Media, April-09
Stand-Alone SRAM Devices Increase Design Flexibility
Microchip Technology Inc., March-09
Security System Offers Protection for FPGA Designs
Wireless Design & Development Advantage Business Media, June-08
Secure NV SRAM Controller with Tamper Detection
Maxim Integrated Products, Inc., November-07
FPGAs With Reduced Standby Current
Lattice Semiconductor Corp., October-05


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Yokogawa Introduces Ultra High Speed CPUs for the FA-M3 PLC Yokogawa has announced the newest addition to the FA-M3 PLC family, the Vitesse Controller.  


SoC Enables Measurement and Diagnostics for High-Power Monitoring in Industrial Applications and Data Centers Maxim’s Teridian power measurement and monitoring SoC provides a fully self-contained energy measurement solution for 3-phase point-of-load (POL) applications.  


Ultra Wideband High Power Amplifier  300 - 3800 MHz / 50 Watts Broadband High Power Amplifier System. The BBS3G6QHM (SKU 2135) is a dual band, ultra broadband high power linear amplifier.  












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