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OK International introduces its Thermal Tweezers Nozzles that reduce thermal stresses placed on PCBs during multiple rework operations for POP package-on-package stacked device components. Using these nozzles, engineers will be able to remove devices, such as multiple vertically-stacked ICs, without damaging the IC packages and without exposing the PCB to excessive reflow cycles over and above the IPC-recommended maximum of five cycles. This maximum can be exceeded after initial assembly, subsequent removal of two or three vertically-stacked components using conventional rework tools, and final reassembly. The nozzles allow heat to be confined to the localized area of the stacked solder joints, thereby preventing the total PCB from reaching reflow temperatures.