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Avago Technologies announces a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. Avago’s WaferCap is a semiconductor-based chip scale packaging (CSP) technology. With potential to reach the 100 GHz frequency range for a SMT packaging, WaferCap CSP has the same dimensions as a 0402 component and can reduce the amount of PCB space an RF device occupies by over 50%. Currently measuring 1.0 x 0.5 mm and a height of 0.25 mm, WaferCap packaged parts reduce the thickness of any assembly. The ultra small product dimensions and performance levels resulting from WaferCap CSP technology allows high frequency devices to be batch packaged cost effectively using standard semiconductor processing techniques. With WaferCap, the air cavity created under the “lid” and immediately above the circuit makes it possible to achieve higher frequency ranges. The use of vias removes the need for costly and performance limiting bond wires.  Additionally, direct contact between the package substrate and the RF MMIC improves RF performance because it reduces the RF signal path and provides less resistance when compared to typical SMT designs.
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Avago Technologies
350 West Trimble Road, Building 90
San Jose, CA, 95131