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Endwave Corporation announces an integrated transceiver board product that is designed to eliminate 30% of the typical mechanical packaging cost from conventional modules, while preserving 100% of electrical performance. The proprietary packaging technique used is called Epsilon Packaging™. Epsilon Packaging reduces the size and weight of a typical transceiver subassembly by replacing heavy-weight metal mechanical items with plated FR-4 and injection molded metallized plastics. The Epsilon Packaging approach also enables mixed technology integration, allowing MMIC, chip-on-board (COB), and surface mount technology (SMT) components to co-exist, thus easing assembly and yielding further cost reductions. Crosstalk between receiver and transmitter sections has been addressed through a high isolation trenching technique, while reflow issues have been resolved through extensive temperature profiling and new plating and assembly methods. Typical applications include homeland security sensors, point-to-point radio, battlefield communications and intelligent automotive cruise control radars.

Endwave Corporation