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The latest addition to Bede’s BedeMetrix™-F X-ray metrology tool delivers non-destructive, high speed film thickness measurement on patterned wafers through combined XRR (X-ray reflectivity) and XRF (X-ray florescence), providing an extended thickness measurement range of 1 nm to 10 μm on a range of material types. Proprietary small spot X-ray optics enable measurement on test pads and inscribe lines down to 100 µm for XRR and 30 µm for XRF, for in-line measurement on product wafers. The family of BedeMetrix-F tools offers fully-automated X-ray metrology for high volume semiconductor manufacturing. The tools deliver internally calibrated, non-destructive control of advanced semiconductor processes. The BedeMetrix family of X-ray metrology tools consists of the BedeMetrix™-L process development tool and the BedeMetrix™-F tools for dedicated process control.

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