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Platform in Package

Freescale Semiconductor introduces a single-chip platform solution based on the ZigBee® specification that is designed to deliver very low power consumption and high performance. The MC1322x platform is engineered to support battery life of up to 20 years, doubling the expectations for current ZigBee solutions.

Freescale’s MC1322x is available in a Platform in Package™ (PiP) solution that integrates the essential components of a ZigBee application within a single package,
The MC1322x is available in a Platform in Package™ (PiP) solution that integrates the essential components of a ZigBee applicationwithin a single package, thereby reducing component count and system cost.
thereby reducing component count and system cost. The MC1322x platform contains a 32-bit microcontroller (MCU), a fully compliant IEEE® 802.15.4 transceiver and RF matching components — all integrated into a small-footprint, land-grid array (LGA) package that virtually eliminates the need for external RF components. The platform solution also features a TurboLink™ technology mode, engineered to increase data rates by up to 2 megabits per second between nodes.

"We have worked closely with our customers to determine the optimal features for our next-generation ZigBee solution, said Brett Black, manager of Freescale’s Wireless Connectivity Operation. "We designed our ZigBee Platform in Package from the ground up to deliver the lowest power consumption and highest performance within a highly integrated package. The MC1322x is designed for a new class of wireless applications that require faster streaming of audio and data files across an IEEE 802.15.4 or ZigBee network.

Itron, a leader in advanced metering technology for the global utility industry, has selected the ZigBee standard for home energy management and load control applications for its OpenWay Advanced Metering Infrastructure (AMI) platform.

"Freescale's Platform in Package raises the bar for other global ZigBee wireless communication platform providers," said Jean-Pierre Desbenoit, electronic and software research director of Schneider Electric. "This platform illustrates what an open-standard technology can provide to OEMs: active competition between best-in-class players who continue to produce innovative solutions. I am confident that the MC1322x platform will contribute to new successes for ZigBee technology."

Freescale’s propriaetary TurboLink technology mode boosts the data rate up to 2 Mb/s, providing an ideal platform to support diverse applications, such as voice, wireless headsets and compressed audio, as well as large data transfers.

The MC1322x devices will switch automatically between the IEEE 802.15.4 protocol and TurboLink technology packets, allowing the developer to take advantage of the high-speed capabilities, while simultaneously controlling and monitoring a ZigBee mesh network. This high-speed capability creates a tremendous opportunity for new designs and applications.

The MC1322x platform was designed to support battery-powered applications. Optimized for Lithium-ion or NiCad batteries, the MC1322x is designed to support batteries as small as coin cells or use standard alkaline batteries that can provide up to 20 years of system life.

Freescale plans to offer MC1322x device samples to key OEM customers in May 2007. General market sampling is planned for December 2007. The company plans to offer the MC1322x device in two package options: a 9.5 × 9.5 mm LGA and a 7 mm × 7 mm QFN.


Freescale Semiconductor
6501 William Cannon Drive West
Austin, TX, 78735

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