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Matrix Semiconductor introduces up to 64 megabytes of storage per 3-D Memory (3DM) chip. Matrix 3DM is available as a standard semiconductor component (TSOP Package) and can also be incorporated into standard memory card formats such as MultiMediaCard (MMC). The primary market for Matrix 3DM is content publishing for mobile devices, such as handheld computers, mobile phones, portable audio and video players, advanced toys, and game consoles. Matrix 3DM is available in both industry standard chip packaging (TSOP) and the MultimediaCard (MMC) format in capacities of 64-megabytes, 32-megabytes, and 16-megabytes.

Matrix Semiconductor, Inc.

Matrix Semiconductor, Inc.
http://www.matrixsemic.com