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The TQP777002 power amplifier module from Link Microtek is a high linearity device designed for 802.11b/g wireless LAN and Bluetooth systems, as well as other applications in the 2.4 GHz ISM band. Manufactured by TriQuint Semiconductor using the company's InGaP HBT process, the module features integrated input and output matching circuitry, an output power detector, a temperature-compensated bias network, and second- and third-stage bias chokes. The TQP777002 offers a typical power gain of 30 dB, with an error vector magnitude of typically < 3% at + 18.5 dBm linear output power under 802.11g modulated signals. Operating from a single 3.3 V supply, the power-amplifier module is housed in an industry-standard VQFN-16 leadless 3.0 × 3.0 mm surface-mount Pb-free package.

Link Microtek