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Amphenol TCS (ATCS) introduces its XCede™ connector platform that is designed to enable future data rate requirements for datacom, telecom, storage and wireless equipment, meeting and exceeding standards set for Ethernet, SONET/SDH, PCIe, Fiber Channel and Infiniband while employing a highly reliable press-fit attachment. A 3D shield technology enables low crosstalk, and it incorporates advanced materials to prevent high frequency resonances. Design features within the connector remove skew within any differential pair, simplifying the board layout process. Secondary routing channels in the connector backplane footprint mean escape is possible on all three sides of the connector module, allowing greater design flexibility to route congested areas and the ability to reduce the number of routing layers required.