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DEK announces that it has developed a multiple package solution that increases cycle time while delivering desirable accuracy and repeatability. DEK’s singulated substrate system can be used to process multiple packages in the same cycle. Enabled by the company’s Virtual Panel Tooling (VPT) technology, parts can be fed into the printing system in JEDEC format carriers and simultaneous processing of individual substrates of varying sizes can occur. Because the advantages of high accuracy mass imaging and full capabilities of the screen printer can be utilized, VPT enables a more seamless crossover between the two arenas of assembly and expands packaging capabilities through increased throughput and yield. This process is suited for high-accuracy or ultra-fine pitch applications such as substrate solder bumping, epoxy printing for die attach, thick film substrate manufacture, fluid dispense and other relevant applications.

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