Friday, May 16, 2008

   Search Sponsor  
Newsletters  |   About Us  |   Feedback



Free White Papers


THIS MONTH IN WDD
Upfront With Nancy
What's Hot
Compliance Update
Product News
Emerging Tech & Markets
Industry News
Technology Awards
Tech Supplements
Tech Channel Articles
Year in Wireless



Web Casts

Wireless White Papers

Buyers Guide

Industry Links

Digital Edition Archive



ABOUT US
Staff
Advisory Board
Editorial Guidelines
Editorial Calendar (pdf)
Media Kit (pdf)
Advertising Rates
BPA Statement (pdf)
List Rental




E-mail for more information

Company's other products

E-mail to a colleague

See similar products

Printer friendly format

Press-fit Version of D-Sub Connector

ERNI announces that it is now offering a press-fit version of its vertical D-sub series. The new press-fit D-sub connectors are available in a 6.3 mm format with 9, 15, 25 or 37 positions. The contacts are plated in the mating area to meet IEC 807-3 / DIN 41652 requirements and tin-plated in the termination area. The front metal shield provides for meeting EMC requirements. The new generation of D-sub connectors is suitable for conventional tin/lead applications as well as for lead-free applications. A metal mounting bracket reliably relieves strains arising from plug insertion, removal, and cable handling. The integrated locking hardware accessories ensure low-resistance ground connection and reliable fastening of cable housings to the connector. Press-fit clips provide the standard means of strain relief to the circuit board, while also providing a path to ground. For handling higher forces, screw locks with M3 and 4#40 UNC threading are available.


ERNI



ERNI Components, Inc.
3005 E. Boundary Terr.
Midlothian, VA, 23112

© 2008 Advantage Business Media

free subscription


Wireless blog:
The Tesla Tales
Check out our blog covering the latest wireless tech and some things that are just plain cool. Click!








Amplifiers
Components
Development Kits/Platforms
Digital Hardware/ Components
Frequency Translators
Integrated Components
Integrated Subsystems
Interface/Interconnect
Materials
Passives
Power
Semis/ICs/MMICs
Services
Signal Processing
Signal Sources
Software
Test & Measurement
Transmission Components








Contact Wireless Design & Development | Terms & Conditions | Privacy Statement

© 2008 Advantage Business Media All rights reserved.