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Ansoft Corporation announces Turbo Package Analyzer™ (TPA) v4.2. This latest version combines new bidirectional integration with Synopsys' Encore™ package-design software with Ansoft's state-of-the-art 3D electromagnetic simulation. It enables full parasitic extraction of complex IC packages, such as ball-grid arrays (BGAs). With AnsoftLinks™, a tool for simplifying data import and export between EDA and CAD packages, TPA v4.2 will generate resistance, inductance and capacitance (RLC) models directly from popular package design tools. It accepts CAD data and fully characterizes the entire package in three dimensions. The 3D analysis provided by the TPA v4.2 extraction engine can solve BGA package structures, including wirebonds, pads, vias, tapered traces, solder balls and non-ideal power and ground structures. For crosstalk simulations, TPA v4.2 automatically provides a multi-conductor coupled RLC model for each lead in the package. The user specifies the number of nearby (adjacent) leads for coupling, and the program automatically calculates all of the parasitics.

Ansoft