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Honeywell has developed a new lead-free packaging technology that improves the thermal management of semiconductor chips. The new product, called Honeywell Pb-free Die Attach Solder, is a lead-free thermal interface material that effectively manages the tremendous heat produced by semiconductor chips in order to improve chip reliability. As semiconductors become more powerful and smaller, more heat is being generated in a confined space when semiconductors are packaged for use in computers and other applications. This tremendous heat can damage the semiconductor or degrade its performance. Honeywell’s thermal management materials are designed to help the semiconductor packaging industry dissipate this heat by filling the gap between the semiconductor and the heat spreader. The lead free material is based on Honeywell’s metallurgical expertise and long experience as a supplier of die-attach solders.

Honeywell
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