Friday, July 25, 2008

   Search Sponsor  
Newsletters  |   About Us  |   Feedback



Free White Papers


THIS MONTH IN WDD
Upfront With Nancy
Brainstorm
Design Talk
What's Hot
Compliance Update
Product News
Emerging Tech & Markets
Industry News
Technology Awards
Tech Supplements
Tech Channel Articles
Year in Wireless



Web Casts

Wireless White Papers

Buyers Guide

Industry Links

Digital Edition Archive



ABOUT US
Staff
Advisory Board
Editorial Guidelines
Editorial Calendar (pdf)
Media Kit (pdf)
Advertising Rates
BPA Statement (pdf)
List Rental




E-mail for more information

Company's other products

E-mail to a colleague

See similar products

Printer friendly format

MOSFET Devices

NEC Electronics America, Inc. introduces the NP series of power MOSFETs. The NP Series features a combination of trench technologies and advanced packaging solutions that result in low leakage current and enable a low on-state resistances (Rdson): 1.4 mΩ (typical). The MOSFETs target markets requiring efficient power management and high current capability, such as automotive and low-voltage motor control. The first device in the series is the NP110. By combining the company's UMOS-4 process technology with a trench configuration, the company has increased the MOSFET's cell density, resulting in decreased Rdson. The UMOS-4 process reduces the size of the trenches and other structures with an ultra fine 0.25 µ design rule. In addition, by fabricating MOSFET structures along the sides of the trenches, designers can reduce the amount of silicon space required. Together, these technologies achieve a cell density of well over 180 Mcells/inch2.


NEC Electronics America, Inc.



NEC Electronics Inc.
2880 Scott Boulevard, M/S SC900 P. O. Box 58062
Santa Clara, CA, 95052

© 2008 Advantage Business Media

free subscription


Wireless blog:
The Tesla Tales
Check out our blog covering the latest wireless tech and some things that are just plain cool. Click!








Amplifiers
Components
Development Kits/Platforms
Digital Hardware/ Components
Frequency Translators
Integrated Components
Integrated Subsystems
Interface/Interconnect
Materials
Passives
Power
Semis/ICs/MMICs
Services
Signal Processing
Signal Sources
Software
Test & Measurement
Transmission Components








Contact Wireless Design & Development | Terms & Conditions | Privacy Statement

© 2008 Advantage Business Media All rights reserved.