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The semiconductor industry is transitioning
to Lead(Pb)-Free materials and processes in order to meet the European Restriction
of Hazardous Substances (RoHS) directive which goes into effect on July 1st,
2006. The RoHS directive restricts the use of certain hazardous substances in
electrical and electronic equipment. The RoHS legislation sets very challenging
threshold limits on lead (Pb), Mercury(Hg), Hexavalent Chromium (Cr6+), Polybrominated
Biphenyls (PBBs), Polybrominated Diphenyl Ethers (PBDEs), and Cadmium, directly
impacting the way integrated circuit components are manufactured. While many
Integrated Circuit (IC) suppliers have developed means to manufacture RoHS compliant
circuits, many are struggling to devise effective means of identifying RoHS
compliant components. It is also a definite industry need to indicate compatibility
with the higher Pb-Free processing temperatures. 
Read more about how Texas Instruments
has implemented one of the most comprehensive Pb-Free component identification
schemes in use in the industry today to allow customers to identify majority
of TI Pb-free components from order entry through rework.